MT53E256M32D2DS-046 vs MT53E256M32D2DS-053 WT:B Comparison
Detailed side-by-side comparison of MT53E256M32D2DS-046 by Micron Technology and MT53E256M32D2DS-053 WT:B by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Micron Technology
MT53E256M32D2DS-046 - 8Gb LPDDR4 SDRAM | Micron Technology
MT53E256M32D2DS-046 ✓ ActiveMicron Technology
MT53E256M32D2DS-053 - 8Gb LPDDR4 DRAM 1.866GHz | Micron
MT53E256M32D2DS-053 WT:B ✓ ActiveSpecification Comparison
| Parameter | MT53E256M32D2DS-046 | MT53E256M32D2DS-053 WT:B |
|---|---|---|
| Brand | Micron Technology | Micron Technology |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9.10 | $21.90 |
| Memory Type | LPDDR4 SDRAM (Mobile DRAM) | LPDDR4 SDRAM (Mobile DRAM) |
| Density | 8 Gbit | 8 Gbit (256M x 32) |
| Organization | 256M x 32 | 256M x 32 |
| Clock Frequency | 2133 MHz | — |
| Data Rate | [DATA_NEEDED: data rate] | 1866 Mbps/pin (1.866 GHz) |
| Core Supply Voltage (VDD) | 1.1 V | — |
| Interface Supply Voltage (VDDQ) | [DATA_NEEDED: VDDQ voltage] | — |
| Package | 200-WFBGA (10 x 14.5 mm) | 200-ball WFBGA, 10 x 14.5 mm |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature (IT grade) | [DATA_NEEDED: IT temperature range] | — |
| Speed Grade | -046 | — |
| Product Generation | MT53E (LPDDR4/LPDDR4X unified die, supports 0.6V VDDQ LPDDR4X operation) | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant (per JLCPCB/LCSC listing) |
| Automotive Qualification (AUT grade variant) | AEC-Q100 qualified (AUT:B variant) | — |
| Packaging (TR suffix) | Tape & Reel (TR) or Tray | — |
| Supply Voltage (VDD2/VDDQ) | — | 1.1 V |
| Operating Temperature (WT grade) | — | -30C to +85C |
| Self-Refresh | — | Auto self-refresh with built-in temperature sensor |
| Features | — | Auto precharge, write leveling, ZQ calibration |
| Bus Width | — | 32-bit |
| Peak Bandwidth (per device) | — | approximately 7.46 GB/s (32-bit x 1866 Mbps) |
| MSL Level | — | [DATA_NEEDED: MSL level] |
| Access Time / CAS Latency | — | [DATA_NEEDED: CL at 1866 Mbps] |
| Refresh Interval | — | [DATA_NEEDED: tREFI specification] |
| Package Height | — | [DATA_NEEDED: max package height] |