NT5CC256M16DP-DI vs H5TC4G63MFR-PBA Comparison

Detailed side-by-side comparison of NT5CC256M16DP-DI by Nanya Technology and H5TC4G63MFR-PBA by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Nanya Technology
NT5CC256M16DP-DI NT5CC256M16DP-DI - 4Gb DDR3L SDRAM 256Mx16 | Nanya

NT5CC256M16DP-DI - 4Gb DDR3L SDRAM 256Mx16 | Nanya

NT5CC256M16DP-DI ✓ Active
SK hynix
H5TC4G63MFR-PBA H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63MFR-PBA ✓ Active

Specification Comparison

Parameter NT5CC256M16DP-DI H5TC4G63MFR-PBA
Brand Nanya Technology SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $6.50 $6.50
Memory Type DDR3L SDRAM DDR3L SDRAM
Density 4Gb 4 Gb
Organization 256M x 16 256M x 16
Supply Voltage 1.35V —
Data Rate 1600 Mbps/pin (800MHz) 1866 Mbps (PC3L-14900)
Package VFBGA-96 96-ball FBGA
Operating Temperature Range -40°C to +95°C (industrial) —
CAS Latency 11, 12, 13 (programmable) —
Burst Length 8, 4 (with burst chop) BL8, BL4 (with burst chop)
Number of Banks 8 8
Interface Differential clock (CK, CK#) —
Refresh Auto-refresh and self-refresh —
On-Die Termination Yes (ODT) —
RoHS Compliant —
Lead-Free Yes —
Supply Voltage (VDD/VDDQ) — 1.35V (+0.100V/-0.067V)
CAS Latency (CL) — Programmable
CAS Write Latency (CWL) — Programmable
Additive Latency — Programmable
On-Die Termination (ODT) — Yes
ZQ Calibration — Yes
Write Leveling — Yes
Auto Self-Refresh — Yes
Temperature-Compensated Self-Refresh — Yes
Process Technology — 30nm-class
RoHS Compliant — Yes (Lead-Free & Halogen-Free)

Datasheets & Resources

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