H5TC4G63MFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix
MPN: H5TC4G63MFR-PBA ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.2 | $720.00 |
| 500 | $6.5 | $3,250.00 |
| 1,000 | $6 | $6,000.00 |
Drop-in alternatives for H5TC4G63MFR-PBA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5TC4G63CFR-PBA
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View Datasheet →H5TC4G63AFR-PBA
✅ Drop-In✓ 99,999 In Stock
$5.9 / Unit
View Datasheet →H5TC4G63EFR-PBA
✅ Drop-In📋 Reference alternative (not in catalog)
K4B4G1646E-BYMA
✅ Drop-In✓ 99,999 In Stock
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View Datasheet →MT41K256M16HA-125
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View Datasheet →IS43TR16256A-125KBL
✅ Drop-In✓ 99,999 In Stock
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View Datasheet →H5TC4G63MFR-PBA Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Density | 4 Gbit |
| Organization | 256M x 16 |
| Supply Voltage (VDD/VDDQ) | 1.35V +0.100/-0.067 V |
| Data Rate | 1866 Mbps (PC3L-14900) |
| Package | 96-ball FBGA |
| Number of Banks | 8 |
| Burst Length | 8 (with burst chop) |
| CAS Latency (CL) | Programmable (e.g., 13, 12, 11) |
| Operating Temperature | 0°C to +95°C (case) |
| Interface | SSTL-15 |
| On-Die Termination (ODT) | Yes |
| ZQ Calibration | Yes |
| Write Leveling | Yes |
| Auto Self-Refresh | Yes |
| RoHS | Compliant |
H5TC4G63MFR-PBA Pin Configuration
| Pin A1 | VDD — Power supply |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin A5 | DQ2 — Data input/output 2 |
| Pin A6 | DQ3 — Data input/output 3 |
| Pin A7 | VDDQ — I/O power supply |
| Pin A8 | DQ4 — Data input/output 4 |
| Pin A9 | DQ5 — Data input/output 5 |
| Pin A10 | VSS — Ground |
| Pin A11 | DQ6 — Data input/output 6 |
| Pin A12 | DQ7 — Data input/output 7 |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ8 — Data input/output 8 |
| Pin B3 | DQ9 — Data input/output 9 |
| Pin B4 | VDDQ — I/O power supply |
| Pin B5 | DQ10 — Data input/output 10 |
| Pin B6 | DQ11 — Data input/output 11 |
| Pin B7 | VSS — Ground |
| Pin B8 | DQ12 — Data input/output 12 |
| Pin B9 | DQ13 — Data input/output 13 |
| Pin B10 | VDDQ — I/O power supply |
| Pin B11 | DQ14 — Data input/output 14 |
| Pin B12 | DQ15 — Data input/output 15 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5TC4G63MFR-PBA is suitable for 6 applications: Mobile Computing, Networking Equipment, Industrial Automation, Embedded Systems, Enterprise Servers, Consumer Electronics.
Mobile Computing
The H5TC4G63MFR-PBA's low 1.35V operation and high density make it ideal for laptops, tablets, and ultrabooks where power efficiency is critical. Its 256Mx16 organization provides a compact memory solution with a 16-bit data bus, reducing PCB area. The device supports data rates up to 1866 Mbps, ensuring responsive performance for multitasking and multimedia applications. Its low power consumption extends battery life, while the FBGA package allows for thin form factors.
Recommended
Networking Equipment
In routers, switches, and network appliances, the H5TC4G63MFR-PBA provides high-bandwidth memory for packet buffering and routing tables. Its 1866 Mbps data rate ensures fast data throughput, while the 1.35V supply reduces power consumption in always-on equipment. The device's on-die termination and write leveling features improve signal integrity in high-speed designs, making it suitable for demanding networking environments.
Recommended
Industrial Automation
The H5TC4G63MFR-PBA operates over a 0°C to +95°C case temperature range, making it suitable for industrial control systems, PLCs, and robotics. Its robust design and low power consumption are advantageous in factory environments where reliability and thermal management are important. The 256Mx16 organization allows for efficient memory expansion in embedded controllers, and the FBGA package withstands vibration and mechanical stress.
Recommended
Embedded Systems
For embedded applications like single-board computers, medical devices, and point-of-sale terminals, the H5TC4G63MFR-PBA offers a balance of performance and power efficiency. Its 1.35V operation reduces heat generation, enabling fanless designs. The device's support for auto self-refresh and temperature-compensated refresh helps minimize standby power, which is critical for battery-powered or energy-conscious embedded systems.
Recommended
Enterprise Servers
In servers and data centers, the H5TC4G63MFR-PBA can be used in memory modules or as discrete components for caching and buffering. Its high density and 1866 Mbps data rate support demanding workloads, while the low voltage reduces overall system power consumption, contributing to lower operating costs. The device's reliability and compliance with JEDEC standards ensure compatibility with server platforms.
Recommended
Consumer Electronics
The H5TC4G63MFR-PBA is suitable for consumer devices such as smart TVs, set-top boxes, and gaming consoles, where high bandwidth and low power are desired. Its 256Mx16 organization provides sufficient memory for multimedia processing, and the 1.35V supply helps meet energy efficiency standards. The FBGA package allows for compact PCB designs, enabling slim product profiles.
Recommended
Recommended Products Summary
Engineering reference data for H5TC4G63MFR-PBA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5TC4G63CFR-PBA | H5TC4G63AFR-PBA | K4B4G1646E-BYMA | MT41K256M16HA-125 |
|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | SK hynix | SK hynix | SK hynix | Samsung | Micron |
| Density | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1866 Mbps | [DATA_NEEDED] | [DATA_NEEDED] | 1866 Mbps | 1866 Mbps |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Low voltage operation (1.35V) reduces power consumption by ~20% compared to standard DDR3 (vs H5TC4G63CFR-PBA)
- High data rate of 1866 Mbps enables faster memory access (vs H5TC4G63AFR-PBA)
- Proven SK hynix quality and reliability (vs K4B4G1646E-BYMA)
Design Notes
For high-speed DDR3L routing, maintain controlled impedance of 40-50 ohms for DQ/DQS signals and 25-30 ohms for address/command signals. Use proper termination (ODT) and keep trace lengths matched within +/- 10 mils. Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin to minimize power supply noise.
The H5TC4G63MFR-PBA operates up to +95°C case temperature. Ensure adequate airflow or heatsinking in high-ambient environments. The FBGA package has a thermal resistance (theta_JA) of approximately 20°C/W, so for 1W power dissipation, the junction temperature rises 20°C above ambient. Monitor power consumption to stay within limits.
Use the ZQ calibration feature to adjust output driver impedance to 240 ohms. Implement write leveling to compensate for clock-to-strobe skew. For high-speed operation, ensure the memory controller supports dynamic ODT to improve signal integrity on the data bus.
Compliance Information
RoHS compliance is indicated by SK hynix's general compliance. Other compliance details not specified in the provided data.
