P1011NSE2DFB vs P1011NXE2DFB Comparison

Detailed side-by-side comparison of P1011NSE2DFB by NXP Semiconductors and P1011NXE2DFB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
P1011NSE2DFB P1011NSE2DFB - QorIQ P1 800MHz PowerPC MPU | NXP Semiconductors

P1011NSE2DFB - QorIQ P1 800MHz PowerPC MPU | NXP Semiconductors

P1011NSE2DFB ✗ End of Life
NXP Semiconductors
P1011NXE2DFB P1011NXE2DFB - QorIQ P1 533MHz e500 SoC | NXP | 689-TEPBGA II

P1011NXE2DFB - QorIQ P1 533MHz e500 SoC | NXP | 689-TEPBGA II

P1011NXE2DFB ✗ End of Life

Specification Comparison

Parameter P1011NSE2DFB P1011NXE2DFB
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status End of Life End of Life
Stock Status In Stock In Stock
Unit Price (USD) $27.50 $125.40
Manufacturer NXP Semiconductors —
Series QorIQ P1 —
Processor Type PowerPC e500v2 QorIQ P1 Communications Processor
Core Count 1 —
Data Bus Width 32-Bit —
Core Speed 800 MHz —
Core Speed (base) 533 MHz (533/333/667 code) —
Memory Controller DDR2/DDR3 with ECC —
Ethernet 3x Gigabit Ethernet MACs 4x GbE MACs (SGMII/RGMII)
PCIe Yes (PCI Express) —
USB USB 2.0 2x USB 2.0 (host + device)
TDM Yes —
Security Engine (SEC) Yes —
L1 Cache 32 KB instruction + 32 KB data —
L2 Cache 256 KB [DATA_NEEDED: L2 cache size]
Package / Case 689-TEPBGA II (31x31 mm) with exposed pad —
Packaging Tray —
Operating Temperature 0 C to 125 C —
Lead Free Status Lead Free —
RoHS Status RoHS Compliant Compliant
Core Architecture — Power Architecture e500, 32-bit
Maximum Core Frequency — 533 MHz
Platform Frequency — 333 MHz
Number of Cores — 1 (single-core)
Package — 689-TEPBGA II (31x31 mm) with exposed pad
Ball Pitch — 1.0 mm
Operating Junction Temperature — -40C to +125C
DDR Memory Controller — 64-bit DDR2/DDR3 with ECC, up to 4 GB
PCI Express — 2x PCIe Gen 1.1 controllers
Security Engine — SEC 4.0 (IPSec/SSL/TLS acceleration)
TDM Interface — Yes (T1/E1)
Silicon Revision — 1.1
Process Technology — 45 nm CMOS
Lead-Free — Yes
MSL Level — [DATA_NEEDED: MSL rating]

Datasheets & Resources

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