P1011NSE2DFB vs P1011NXE2DFB Comparación
Comparación detallada lado a lado de P1011NSE2DFB por NXP Semiconductors y P1011NXE2DFB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
P1011NSE2DFB - QorIQ P1 800MHz PowerPC MPU | NXP Semiconductors
P1011NSE2DFB ✗ Fin de vidaNXP Semiconductors
P1011NXE2DFB - QorIQ P1 533MHz e500 SoC | NXP | 689-TEPBGA II
P1011NXE2DFB ✗ Fin de vidaComparación de especificaciones
| Parámetro | P1011NSE2DFB | P1011NXE2DFB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,50 | $125,40 |
| Manufacturer | NXP Semiconductors | — |
| Series | QorIQ P1 | — |
| Processor Type | PowerPC e500v2 | QorIQ P1 Communications Processor |
| Core Count | 1 | — |
| Ancho del bus de datos | 32-Bit | — |
| Core Speed | 800 MHz | — |
| Core Speed (base) | 533 MHz (533/333/667 code) | — |
| Memory Controller | DDR2/DDR3 with ECC | — |
| Ethernet | 3x Gigabit Ethernet MACs | 4x GbE MACs (SGMII/RGMII) |
| PCIe | Yes (PCI Express) | — |
| USB | USB 2.0 | 2x USB 2.0 (host + device) |
| TDM | Yes | — |
| Security Engine (SEC) | Yes | — |
| L1 Cache | 32 KB instruction + 32 KB data | — |
| L2 Cache | 256 KB | [DATA_NEEDED: L2 cache size] |
| Encapsulado / Carcasa | 689-TEPBGA II (31x31 mm) with exposed pad | — |
| Packaging | Tray | — |
| Temperatura de funcionamiento | 0 C to 125 C | — |
| Lead Free Status | Lead Free | — |
| Estado RoHS | RoHS Compliant | Compliant |
| Core Architecture | — | Power Architecture e500, 32-bit |
| Maximum Core Frequency | — | 533 MHz |
| Platform Frequency | — | 333 MHz |
| Number of Cores | — | 1 (single-core) |
| Encapsulado | — | 689-TEPBGA II (31x31 mm) with exposed pad |
| Ball Pitch | — | 1.0 mm |
| Temperatura de unión de funcionamiento | — | -40C to +125C |
| DDR Memory Controller | — | 64-bit DDR2/DDR3 with ECC, up to 4 GB |
| PCI Express | — | 2x PCIe Gen 1.1 controllers |
| Security Engine | — | SEC 4.0 (IPSec/SSL/TLS acceleration) |
| TDM Interface | — | Yes (T1/E1) |
| Silicon Revision | — | 1.1 |
| Process Technology | — | 45 nm CMOS |
| Lead-Free | — | Yes |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |