P1013NXN2LFB vs P1022NXN2LFB Comparison

Detailed side-by-side comparison of P1013NXN2LFB by NXP Semiconductors and P1022NXN2LFB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
P1013NXN2LFB P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP

P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP

P1013NXN2LFB ⚠ Last Time Buy
NXP Semiconductors
P1022NXN2LFB P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB ⚠ Last Time Buy

Specification Comparison

Parameter P1013NXN2LFB P1022NXN2LFB
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Last Time Buy Last Time Buy
Stock Status In Stock In Stock
Unit Price (USD) $32.85 $78.40
Family QorIQ P1022 (P1 series) —
Core Architecture 32-bit Power Architecture e500v2 —
Number of Cores 1 —
Core Frequency 1.067 GHz —
L1 Cache (per core) 32 KB instruction + 32 KB data —
L2 Cache 256 KB platform cache —
Memory Controller DDR2/DDR3 with ECC, 64-bit data bus DDR2/DDR3 with ECC support, up to 32-bit
Ethernet MACs 3 x 10/100/1000 (2x SGMII/HS SerDes, 1x RGMII) 3 x 10/100/1000 Mbps Gigabit
PCI Express 2 x PCIe Gen 1.1 (x4 / x1) —
USB 1 x USB 2.0 with integrated PHY USB 2.0 host/device
Other Interfaces eSDHC, eSPI, I2C, UART, eLBC, LCD controller —
Package 689-ball TEPBGA II (31 mm x 31 mm) —
Operating Temperature -40C to +125C (junction) -40 °C to +125 °C (industrial)
Process 45 nm SOI —
Supply Voltage 1.5 V / 1.8 V / 2.5 V / 3.3 V 3.13 V to 3.47 V
Security SEC 4.0 (optional crypto accelerator) on die variant —
Mounting Type Surface Mount (BGA) Surface Mount (BGA, requires thermal via array under die)
RoHS Status Compliant (Pb-free ball finish) —
Architecture — Power Architecture e500 dual-core (RISC, 32-bit)
Clock Speed (Core) — 1.067 GHz
Platform Version — 1067/533/667 ET NE r1.1
Core Count — 2
Package Type — TEPBGA-689 (Plastic, halogen-free, RoHS-compliant)
Package Dimensions — 31 x 31 mm, 2.23 mm height
Pin Count — 689
PCIe Interfaces — 3 x PCIe Gen1
Display Controller — 32-bit LCD controller
Security Engine — Integrated (symmetric/asymmetric crypto acceleration)
RoHS Compliance — Yes (halogen-free)

Datasheets & Resources

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