P1013NXN2LFB vs P1022NXN2LFB Vergleich

Detaillierter Direktvergleich von P1013NXN2LFB von NXP Semiconductors und P1022NXN2LFB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
P1013NXN2LFB P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP

P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP

P1013NXN2LFB ⚠ Letzte Bestellmöglichkeit
NXP Semiconductors
P1022NXN2LFB P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter P1013NXN2LFB P1022NXN2LFB
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Letzte Kaufgelegenheit Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $32,85 $78,40
Family QorIQ P1022 (P1 series) —
Core Architecture 32-bit Power Architecture e500v2 —
Number of Cores 1 —
Core Frequency 1.067 GHz —
L1 Cache (per core) 32 KB instruction + 32 KB data —
L2 Cache 256 KB platform cache —
Memory Controller DDR2/DDR3 with ECC, 64-bit data bus DDR2/DDR3 with ECC support, up to 32-bit
Ethernet MACs 3 x 10/100/1000 (2x SGMII/HS SerDes, 1x RGMII) 3 x 10/100/1000 Mbps Gigabit
PCI Express 2 x PCIe Gen 1.1 (x4 / x1) —
USB 1 x USB 2.0 with integrated PHY USB 2.0 host/device
Other Interfaces eSDHC, eSPI, I2C, UART, eLBC, LCD controller —
Gehäuse 689-ball TEPBGA II (31 mm x 31 mm) —
Betriebstemperatur -40C to +125C (junction) -40 °C to +125 °C (industrial)
Process 45 nm SOI —
Versorgungsspannung 1.5 V / 1.8 V / 2.5 V / 3.3 V 3.13 V to 3.47 V
Security SEC 4.0 (optional crypto accelerator) on die variant —
Montageart Surface Mount (BGA) Surface Mount (BGA, requires thermal via array under die)
RoHS-Status Compliant (Pb-free ball finish) —
Architecture — Power Architecture e500 dual-core (RISC, 32-bit)
Clock Speed (Core) — 1.067 GHz
Platform Version — 1067/533/667 ET NE r1.1
Core Count — 2
Package Type — TEPBGA-689 (Plastic, halogen-free, RoHS-compliant)
Package Dimensions — 31 x 31 mm, 2.23 mm height
Pin-Anzahl — 689
PCIe Interfaces — 3 x PCIe Gen1
Display Controller — 32-bit LCD controller
Security Engine — Integrated (symmetric/asymmetric crypto acceleration)
RoHS Compliance — Yes (halogen-free)

Datenblätter & Ressourcen

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