P1022NXN2LFB vs P1013NXN2LFB Comparison

Detailed side-by-side comparison of P1022NXN2LFB by NXP Semiconductors and P1013NXN2LFB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
P1022NXN2LFB P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB ⚠ Last Time Buy
NXP Semiconductors
P1013NXN2LFB P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP

P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP

P1013NXN2LFB ⚠ Last Time Buy

Specification Comparison

Parameter P1022NXN2LFB P1013NXN2LFB
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Last Time Buy Last Time Buy
Stock Status In Stock In Stock
Unit Price (USD) $78.40 $32.85
Architecture Power Architecture e500 dual-core (RISC, 32-bit) —
Clock Speed (Core) 1.067 GHz —
Platform Version 1067/533/667 ET NE r1.1 —
Core Count 2 —
Package Type TEPBGA-689 (Plastic, halogen-free, RoHS-compliant) —
Package Dimensions 31 x 31 mm, 2.23 mm height —
Pin Count 689 —
Operating Temperature -40 °C to +125 °C (industrial) -40C to +125C (junction)
Supply Voltage 3.13 V to 3.47 V 1.5 V / 1.8 V / 2.5 V / 3.3 V
Memory Controller DDR2/DDR3 with ECC support, up to 32-bit DDR2/DDR3 with ECC, 64-bit data bus
Ethernet MACs 3 x 10/100/1000 Mbps Gigabit 3 x 10/100/1000 (2x SGMII/HS SerDes, 1x RGMII)
PCIe Interfaces 3 x PCIe Gen1 —
USB USB 2.0 host/device 1 x USB 2.0 with integrated PHY
Display Controller 32-bit LCD controller —
Security Engine Integrated (symmetric/asymmetric crypto acceleration) —
RoHS Compliance Yes (halogen-free) —
Mounting Type Surface Mount (BGA, requires thermal via array under die) Surface Mount (BGA)
Family — QorIQ P1022 (P1 series)
Core Architecture — 32-bit Power Architecture e500v2
Number of Cores — 1
Core Frequency — 1.067 GHz
L1 Cache (per core) — 32 KB instruction + 32 KB data
L2 Cache — 256 KB platform cache
PCI Express — 2 x PCIe Gen 1.1 (x4 / x1)
Other Interfaces — eSDHC, eSPI, I2C, UART, eLBC, LCD controller
Package — 689-ball TEPBGA II (31 mm x 31 mm)
Process — 45 nm SOI
Security — SEC 4.0 (optional crypto accelerator) on die variant
RoHS Status — Compliant (Pb-free ball finish)

Datasheets & Resources

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