P1022NXN2LFB vs P1013NXN2LFB Vergleich

Detaillierter Direktvergleich von P1022NXN2LFB von NXP Semiconductors und P1013NXN2LFB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
P1022NXN2LFB P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB ⚠ Letzte Bestellmöglichkeit
NXP Semiconductors
P1013NXN2LFB P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP

P1013NXN2LFB - QorIQ P1022 Power Arch SoC 1GHz | NXP

P1013NXN2LFB ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter P1022NXN2LFB P1013NXN2LFB
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Letzte Kaufgelegenheit Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $78,40 $32,85
Architecture Power Architecture e500 dual-core (RISC, 32-bit) —
Clock Speed (Core) 1.067 GHz —
Platform Version 1067/533/667 ET NE r1.1 —
Core Count 2 —
Package Type TEPBGA-689 (Plastic, halogen-free, RoHS-compliant) —
Package Dimensions 31 x 31 mm, 2.23 mm height —
Pin-Anzahl 689 —
Betriebstemperatur -40 °C to +125 °C (industrial) -40C to +125C (junction)
Versorgungsspannung 3.13 V to 3.47 V 1.5 V / 1.8 V / 2.5 V / 3.3 V
Memory Controller DDR2/DDR3 with ECC support, up to 32-bit DDR2/DDR3 with ECC, 64-bit data bus
Ethernet MACs 3 x 10/100/1000 Mbps Gigabit 3 x 10/100/1000 (2x SGMII/HS SerDes, 1x RGMII)
PCIe Interfaces 3 x PCIe Gen1 —
USB USB 2.0 host/device 1 x USB 2.0 with integrated PHY
Display Controller 32-bit LCD controller —
Security Engine Integrated (symmetric/asymmetric crypto acceleration) —
RoHS Compliance Yes (halogen-free) —
Montageart Surface Mount (BGA, requires thermal via array under die) Surface Mount (BGA)
Family — QorIQ P1022 (P1 series)
Core Architecture — 32-bit Power Architecture e500v2
Number of Cores — 1
Core Frequency — 1.067 GHz
L1 Cache (per core) — 32 KB instruction + 32 KB data
L2 Cache — 256 KB platform cache
PCI Express — 2 x PCIe Gen 1.1 (x4 / x1)
Other Interfaces — eSDHC, eSPI, I2C, UART, eLBC, LCD controller
Gehäuse — 689-ball TEPBGA II (31 mm x 31 mm)
Process — 45 nm SOI
Security — SEC 4.0 (optional crypto accelerator) on die variant
RoHS-Status — Compliant (Pb-free ball finish)

Datenblätter & Ressourcen

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