S9S08AW60E5MFGE vs MC9S08AW32CFUE Comparison
Detailed side-by-side comparison of S9S08AW60E5MFGE by NXP Semiconductors and MC9S08AW32CFUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ Active
Specification Comparison
| Parameter | S9S08AW60E5MFGE | MC9S08AW32CFUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $6.05 | $7.18 |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 2 KB |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Supply Voltage | 3 V / 3.3 V / 5 V | — |
| Package | 44-pin LQFP (10 x 10 mm) | 64-QFP (14x14 mm) |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | 10-bit, 8-channel |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | Multiple TPM/MTIM (see datasheet) |
| Debug Interface | BDM (Background Debug Mode) | BDM (Background Debug Mode) |
| Operating Temperature | -40C to +125C (automotive range) | -40C to +85C (industrial) |
| Mounting Type | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Core | — | S08 (HCS08 enhanced 8-bit) |
| Program Memory | — | 32 KB Flash |
| Maximum CPU Frequency | — | 40 MHz |
| Operating Voltage | — | 2.7 V to 5.5 V |
| Communication Interfaces | — | 2x SCI (UART), 1x SPI, 1x IIC |
| GPIO | — | Up to 54 |
| MSL Level | — | 3 |
| RoHS Status | — | Compliant |
| Lead-Free | — | Yes |