S9S08AW60E5MFGE vs MC9S08AW32CFUE 对比

详细并排对比 S9S08AW60E5MFGE 出自 NXP Semiconductors 和 MC9S08AW32CFUE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
S9S08AW60E5MFGE S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE ✓ 量产中
NXP Semiconductors
MC9S08AW32CFUE MC9S08AW32CFUE - 8-Bit 40MHz 32KB Flash MCU | NXP S08

MC9S08AW32CFUE - 8-Bit 40MHz 32KB Flash MCU | NXP S08

MC9S08AW32CFUE Nrnd

规格对比

参数 S9S08AW60E5MFGE MC9S08AW32CFUE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 不推荐新设计
库存状态 有库存 有库存
单价(USD) $6.05 $7.18
Core Architecture HCS08 (S08 enhanced), 8-bit CISC —
CPU Clock (Max) 40 MHz (20 MHz bus) —
Program Flash 60 KB (60K x 8) —
RAM [DATA_NEEDED: RAM size] 2 KB
EEPROM / Data Flash [DATA_NEEDED: data EEPROM size] —
电源电压 3 V / 3.3 V / 5 V —
封装 44-pin LQFP (10 x 10 mm) 64-QFP (14x14 mm)
I/O Pins [DATA_NEEDED: GPIO count] —
ADC Multi-channel 10-bit (per family) 10-bit, 8-channel
Communication SCI (UART), SPI, I2C —
Timers TPM modules with PWM channels Multiple TPM/MTIM (see datasheet)
Debug Interface BDM (Background Debug Mode) BDM (Background Debug Mode)
工作温度 -40C to +125C (automotive range) -40C to +85C (industrial)
安装类型 Surface Mount Surface Mount
Family S08 / MC9S08AW60 series —
Automotive/Industrial Dual-targeted —
Lead Free / RoHS Yes (per suffix "E" = Pb-free, "R" = tape & reel) —
Core — S08 (HCS08 enhanced 8-bit)
Program Memory — 32 KB Flash
Maximum CPU Frequency — 40 MHz
Operating Voltage — 2.7 V to 5.5 V
Communication Interfaces — 2x SCI (UART), 1x SPI, 1x IIC
GPIO — Up to 54
MSL 等级 — 3
RoHS 状态 — Compliant
Lead-Free — Yes

数据手册与资源

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