S9S08AW60E5MFGE vs MC9S08AW32CFUE 비교

다음의 상세 나란히 비교: S9S08AW60E5MFGE 제조: NXP Semiconductors 및 MC9S08AW32CFUE 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
S9S08AW60E5MFGE S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE ✓ 활성
NXP Semiconductors
MC9S08AW32CFUE MC9S08AW32CFUE - 8-Bit 40MHz 32KB Flash MCU | NXP S08

MC9S08AW32CFUE - 8-Bit 40MHz 32KB Flash MCU | NXP S08

MC9S08AW32CFUE Nrnd

사양 비교

파라미터 S9S08AW60E5MFGE MC9S08AW32CFUE
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 활성 NRND
재고 상태 In Stock In Stock
단가 (USD) $6.05 $7.18
Core Architecture HCS08 (S08 enhanced), 8-bit CISC —
CPU Clock (Max) 40 MHz (20 MHz bus) —
Program Flash 60 KB (60K x 8) —
RAM [DATA_NEEDED: RAM size] 2 KB
EEPROM / Data Flash [DATA_NEEDED: data EEPROM size] —
공급 전압 3 V / 3.3 V / 5 V —
패키지 44-pin LQFP (10 x 10 mm) 64-QFP (14x14 mm)
I/O Pins [DATA_NEEDED: GPIO count] —
ADC Multi-channel 10-bit (per family) 10-bit, 8-channel
Communication SCI (UART), SPI, I2C —
Timers TPM modules with PWM channels Multiple TPM/MTIM (see datasheet)
Debug Interface BDM (Background Debug Mode) BDM (Background Debug Mode)
동작 온도 -40C to +125C (automotive range) -40C to +85C (industrial)
실장 유형 Surface Mount Surface Mount
Family S08 / MC9S08AW60 series —
Automotive/Industrial Dual-targeted —
Lead Free / RoHS Yes (per suffix "E" = Pb-free, "R" = tape & reel) —
Core — S08 (HCS08 enhanced 8-bit)
Program Memory — 32 KB Flash
Maximum CPU Frequency — 40 MHz
Operating Voltage — 2.7 V to 5.5 V
Communication Interfaces — 2x SCI (UART), 1x SPI, 1x IIC
GPIO — Up to 54
MSL 레벨 — 3
RoHS 상태 — Compliant
Lead-Free — Yes

데이터시트 & 자료

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