S9S08DV32F1MLC vs MC9S08DV60AMLC Comparison
Detailed side-by-side comparison of S9S08DV32F1MLC by NXP Semiconductors and MC9S08DV60AMLC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | S9S08DV32F1MLC | MC9S08DV60AMLC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2.74 | $2.45 |
| Core | HCS08 (enhanced HC08, CISC) | — |
| CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 2 KB (2K x 8) | — |
| Number of I/O | 25 | [DATA_NEEDED: GPIO count] |
| ADC Resolution | 12-bit | — |
| ADC Channels | 16 / 24 channels | — |
| ADC Conversion Time | 2.5 us | — |
| Interrupt / Reset Sources | Up to 32 | — |
| Supply Voltage | 3.3 V / 5 V | [DATA_NEEDED: supply voltage range] |
| Oscillator Type | External | — |
| Instruction Set | HC08 + BGND | HC08 with added BGND instruction |
| Package / Case | 32-LQFP (7x7 mm) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Operating Temperature | -40C to +125C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Flash Memory | — | 60 KB (60K x 8) |
| RAM Size | — | 3 KB |
| Package | — | 32-LQFP (7 x 7 mm) |
| Interrupt/Reset Sources | — | Up to 32 |
| On-Chip Debug | — | Background Debug Mode (BDM) emulation/debug |
| Communication Interface | — | Embedded CAN |
| Target Markets | — | Automotive and industrial |
| Lifecycle Status | — | NRND (Not Recommended for New Designs) |