S9S08DV32F1MLC vs MC9S08DV60AMLC 对比
详细并排对比 S9S08DV32F1MLC 出自 NXP Semiconductors 和 MC9S08DV60AMLC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | S9S08DV32F1MLC | MC9S08DV60AMLC |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2.74 | $2.45 |
| Core | HCS08 (enhanced HC08, CISC) | — |
| CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 2 KB (2K x 8) | — |
| Number of I/O | 25 | [DATA_NEEDED: GPIO count] |
| ADC Resolution | 12-bit | — |
| ADC Channels | 16 / 24 channels | — |
| ADC Conversion Time | 2.5 us | — |
| Interrupt / Reset Sources | Up to 32 | — |
| 电源电压 | 3.3 V / 5 V | [DATA_NEEDED: supply voltage range] |
| Oscillator Type | External | — |
| Instruction Set | HC08 + BGND | HC08 with added BGND instruction |
| 封装 / 外壳 | 32-LQFP (7x7 mm) | — |
| 安装类型 | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| 工作温度 | -40C to +125C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Flash Memory | — | 60 KB (60K x 8) |
| RAM Size | — | 3 KB |
| 封装 | — | 32-LQFP (7 x 7 mm) |
| Interrupt/Reset Sources | — | Up to 32 |
| On-Chip Debug | — | Background Debug Mode (BDM) emulation/debug |
| Communication Interface | — | Embedded CAN |
| Target Markets | — | Automotive and industrial |
| 生命周期状态 | — | NRND (Not Recommended for New Designs) |