S9S08DV32F1MLC vs MC9S08DV60AMLC Comparación
Comparación detallada lado a lado de S9S08DV32F1MLC por NXP Semiconductors y MC9S08DV60AMLC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | S9S08DV32F1MLC | MC9S08DV60AMLC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,74 | $2,45 |
| Core | HCS08 (enhanced HC08, CISC) | — |
| CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 2 KB (2K x 8) | — |
| Number of I/O | 25 | [DATA_NEEDED: GPIO count] |
| ADC Resolution | 12-bit | — |
| ADC Channels | 16 / 24 channels | — |
| ADC Conversion Time | 2.5 us | — |
| Interrupt / Reset Sources | Up to 32 | — |
| Tensión de alimentación | 3.3 V / 5 V | [DATA_NEEDED: supply voltage range] |
| Oscillator Type | External | — |
| Instruction Set | HC08 + BGND | HC08 with added BGND instruction |
| Encapsulado / Carcasa | 32-LQFP (7x7 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Temperatura de funcionamiento | -40C to +125C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Flash Memory | — | 60 KB (60K x 8) |
| RAM Size | — | 3 KB |
| Encapsulado | — | 32-LQFP (7 x 7 mm) |
| Interrupt/Reset Sources | — | Up to 32 |
| On-Chip Debug | — | Background Debug Mode (BDM) emulation/debug |
| Communication Interface | — | Embedded CAN |
| Target Markets | — | Automotive and industrial |
| Estado del ciclo de vida | — | NRND (Not Recommended for New Designs) |