S9S08DV32F1MLC vs MC9S08DV60AMLC Vergleich
Detaillierter Direktvergleich von S9S08DV32F1MLC von NXP Semiconductors und MC9S08DV60AMLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | S9S08DV32F1MLC | MC9S08DV60AMLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,74 | $2,45 |
| Core | HCS08 (enhanced HC08, CISC) | — |
| CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 2 KB (2K x 8) | — |
| Number of I/O | 25 | [DATA_NEEDED: GPIO count] |
| ADC Resolution | 12-bit | — |
| ADC Channels | 16 / 24 channels | — |
| ADC Conversion Time | 2.5 us | — |
| Interrupt / Reset Sources | Up to 32 | — |
| Versorgungsspannung | 3.3 V / 5 V | [DATA_NEEDED: supply voltage range] |
| Oscillator Type | External | — |
| Instruction Set | HC08 + BGND | HC08 with added BGND instruction |
| Gehäuse / Bauform | 32-LQFP (7x7 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Betriebstemperatur | -40C to +125C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Flash Memory | — | 60 KB (60K x 8) |
| RAM Size | — | 3 KB |
| Gehäuse | — | 32-LQFP (7 x 7 mm) |
| Interrupt/Reset Sources | — | Up to 32 |
| On-Chip Debug | — | Background Debug Mode (BDM) emulation/debug |
| Communication Interface | — | Embedded CAN |
| Target Markets | — | Automotive and industrial |
| Lebenszyklusstatus | — | NRND (Not Recommended for New Designs) |