S9S08QD4J2MSC vs S9S08QD4J2MSCR Comparison

Detailed side-by-side comparison of S9S08QD4J2MSC by NXP Semiconductors and S9S08QD4J2MSCR by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
S9S08QD4J2MSC S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC ✓ Active
NXP Semiconductors
S9S08QD4J2MSCR S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR ✓ Active

Specification Comparison

Parameter S9S08QD4J2MSC S9S08QD4J2MSCR
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $1.14 $1.55
Manufacturer NXP Semiconductors —
Core Architecture HCS08 (8-bit, HC08-compatible with BGND) —
CPU Frequency 16 MHz —
Program Memory (Flash) 4 KB (4K x 8) —
RAM 256 bytes —
Package 8-SOIC (0.154", 3.90 mm width) 8-SOIC (0.154 inch, 3.90 mm width)
Mounting Type Surface Mount Surface Mount
Operating Temperature -40C to +125C (automotive grade) -40 C to +125 C
AEC-Q100 Qualification Qualified —
Number of Pins 8 —
General-Purpose I/O Pins 4 (plus 1 input-only and 1 output-only pin) —
Supply Voltage [DATA_NEEDED: VDD range] 2.7 V to 5.5 V
ADC On-chip ADC (channel count per datasheet) 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI
Timers On-chip timer(s) TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM)
Communication SCI/SPI (per datasheet) —
Debug Interface Background Debug Mode (BDM) with breakpoints —
Low-Power Modes STOP and WAIT —
RoHS Status [DATA_NEEDED: RoHS status] Compliant
Core — HCS08
Instruction Set Architecture — CISC (68 HC08 with added BGND)
Core Width — 8-bit
Maximum CPU Frequency — 16 MHz
Program Memory Type — Flash
Program Memory Size — 4 KB (4K x 8)
Packaging — Tape & Reel (TR)
I/O Pins — 4
Debug — Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints

Datasheets & Resources

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