S9S08QD4J2MSC vs S9S08QD4J2MSCR Vergleich

Detaillierter Direktvergleich von S9S08QD4J2MSC von NXP Semiconductors und S9S08QD4J2MSCR von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
S9S08QD4J2MSC S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC ✓ Aktiv
NXP Semiconductors
S9S08QD4J2MSCR S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR ✓ Aktiv

Spezifikationsvergleich

Parameter S9S08QD4J2MSC S9S08QD4J2MSCR
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1,14 $1,55
Manufacturer NXP Semiconductors —
Core Architecture HCS08 (8-bit, HC08-compatible with BGND) —
CPU Frequency 16 MHz —
Program Memory (Flash) 4 KB (4K x 8) —
RAM 256 bytes —
Gehäuse 8-SOIC (0.154", 3.90 mm width) 8-SOIC (0.154 inch, 3.90 mm width)
Montageart Surface Mount Surface Mount
Betriebstemperatur -40C to +125C (automotive grade) -40 C to +125 C
AEC-Q100 Qualification Qualified —
Anzahl der Pins 8 —
General-Purpose I/O Pins 4 (plus 1 input-only and 1 output-only pin) —
Versorgungsspannung [DATA_NEEDED: VDD range] 2.7 V to 5.5 V
ADC On-chip ADC (channel count per datasheet) 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI
Timers On-chip timer(s) TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM)
Communication SCI/SPI (per datasheet) —
Debug Interface Background Debug Mode (BDM) with breakpoints —
Low-Power Modes STOP and WAIT —
RoHS-Status [DATA_NEEDED: RoHS status] Compliant
Core — HCS08
Instruction Set Architecture — CISC (68 HC08 with added BGND)
Core Width — 8-bit
Maximum CPU Frequency — 16 MHz
Program Memory Type — Flash
Program Memory Size — 4 KB (4K x 8)
Packaging — Tape & Reel (TR)
I/O Pins — 4
Debug — Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints

Datenblätter & Ressourcen

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