S9S08QD4J2MSC vs S9S08QD4J2MSCR Сравнение
Подробное сравнение бок о бок S9S08QD4J2MSC от NXP Semiconductors и S9S08QD4J2MSCR от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP
S9S08QD4J2MSC ✓ АктивенСравнение характеристик
| Параметр | S9S08QD4J2MSC | S9S08QD4J2MSCR |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $1,14 | $1,55 |
| Manufacturer | NXP Semiconductors | — |
| Core Architecture | HCS08 (8-bit, HC08-compatible with BGND) | — |
| CPU Frequency | 16 MHz | — |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 256 bytes | — |
| Корпус | 8-SOIC (0.154", 3.90 mm width) | 8-SOIC (0.154 inch, 3.90 mm width) |
| Тип монтажа | Surface Mount | Surface Mount |
| Рабочая температура | -40C to +125C (automotive grade) | -40 C to +125 C |
| AEC-Q100 Qualification | Qualified | — |
| Количество выводов | 8 | — |
| General-Purpose I/O Pins | 4 (plus 1 input-only and 1 output-only pin) | — |
| Напряжение питания | [DATA_NEEDED: VDD range] | 2.7 V to 5.5 V |
| ADC | On-chip ADC (channel count per datasheet) | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI |
| Timers | On-chip timer(s) | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) |
| Communication | SCI/SPI (per datasheet) | — |
| Debug Interface | Background Debug Mode (BDM) with breakpoints | — |
| Low-Power Modes | STOP and WAIT | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Core | — | HCS08 |
| Instruction Set Architecture | — | CISC (68 HC08 with added BGND) |
| Core Width | — | 8-bit |
| Maximum CPU Frequency | — | 16 MHz |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 4 KB (4K x 8) |
| Packaging | — | Tape & Reel (TR) |
| I/O Pins | — | 4 |
| Debug | — | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints |