XC3S50-4TQG144C vs XC3S50-5TQG144C Comparison

Detailed side-by-side comparison of XC3S50-4TQG144C by AMD and XC3S50-5TQG144C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC3S50-4TQG144C XC3S50-5TQG144C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Obsolete
Device Type FPGA FPGA
FPGA Family Spartan-3 Spartan-3
System Gates 50,000 gates 50,000 gates
Logic Cells 1,728 cells 1,728 cells
Performance Rating 630 MHz —
Process Technology 90 nm 90 nm
Core Supply Voltage 1.2 V nominal 1.2 V
Operating Supply Voltage Range 1.14 V to 1.26 V —
I/O Count 97 I/O 97 I/O
Embedded Memory [DATA_NEEDED: embedded memory capacity] —
Package Type 144-lead TQFP —
Mounting Type Surface mount Surface mount
Operating Junction Temperature Range 0°C to 85°C —
Device Classification Commercial temperature grade —
Configuration Interface [DATA_NEEDED: configuration interface details] —
I/O Standards [DATA_NEEDED: supported I/O standards] —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH status]
Logic Blocks — 192 blocks
Maximum Clock Frequency — 725 MHz
Package — 144-pin TQFP
Package Code — TQ144
Lead-Free Status — Lead free
Operating Temperature — 0°C to 85°C
Terminal Count — 144 terminals
Terminal Form — Gull wing
Package Shape — Square
Embedded Block RAM — [DATA_NEEDED: Embedded block RAM capacity]
Dedicated Multipliers — [DATA_NEEDED: Dedicated multiplier count]
Configuration Memory — [DATA_NEEDED: Configuration memory type and capacity]

Datasheets & Resources

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