XC3S50-4TQG144C vs XC3S50-5TQG144C Vergleich
Detaillierter Direktvergleich von XC3S50-4TQG144C von AMD und XC3S50-5TQG144C von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | XC3S50-4TQG144C | XC3S50-5TQG144C |
|---|---|---|
| Marke | AMD | AMD |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Device Type | FPGA | FPGA |
| FPGA Family | Spartan-3 | Spartan-3 |
| System Gates | 50,000 gates | 50,000 gates |
| Logic Cells | 1,728 cells | 1,728 cells |
| Performance Rating | 630 MHz | — |
| Process Technology | 90 nm | 90 nm |
| Core Supply Voltage | 1.2 V nominal | 1.2 V |
| Operating Supply Voltage Range | 1.14 V to 1.26 V | — |
| I/O Count | 97 I/O | 97 I/O |
| Embedded Memory | [DATA_NEEDED: embedded memory capacity] | — |
| Package Type | 144-lead TQFP | — |
| Montageart | Surface mount | Surface mount |
| Betriebs-Sperrschichttemperaturbereich | 0°C to 85°C | — |
| Device Classification | Commercial temperature grade | — |
| Configuration Interface | [DATA_NEEDED: configuration interface details] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| Logic Blocks | — | 192 blocks |
| Maximale Taktfrequenz | — | 725 MHz |
| Gehäuse | — | 144-pin TQFP |
| Package Code | — | TQ144 |
| Lead-Free Status | — | Lead free |
| Betriebstemperatur | — | 0°C to 85°C |
| Terminal Count | — | 144 terminals |
| Terminal Form | — | Gull wing |
| Package Shape | — | Square |
| Embedded Block RAM | — | [DATA_NEEDED: Embedded block RAM capacity] |
| Dedicated Multipliers | — | [DATA_NEEDED: Dedicated multiplier count] |
| Configuration Memory | — | [DATA_NEEDED: Configuration memory type and capacity] |