XC6SLX100-2FGG676C vs XC6SLX75-3FGG676C Comparison

Detailed side-by-side comparison of XC6SLX100-2FGG676C by AMD and XC6SLX75-3FGG676C by Xilinx. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX100-2FGG676C XC6SLX75-3FGG676C
Brand AMD Xilinx
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family Spartan-6 LX —
Logic Cells 101,261 74,637
System Gates 4,939,776 —
Slices 15,822 —
Block RAM 3.8 Mb (4824 Kbits) 3,096 Kbit
DSP Slices 180 DSP48A1 —
Maximum User I/O 480 —
Maximum I/O Banks 6 —
Speed Grade -2 -3 (highest performance grade)
Temperature Grade Commercial (0 C to +85 C) —
Package FBGA-676 (FGG676) 27x27 mm —
Ball Pitch 0.8 mm —
Core Voltage 1.2 V —
Process Technology 45 nm CMOS 45 nm CMOS
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status Compliant —
Lead Free Yes —
Device Type — FPGA (Field Programmable Gate Array)
FPGA Family — Spartan-6 LX
Configurable Logic Blocks (CLBs) — 5,831
User I/O — 408
DSP48A1 Slices — 132
Internal Frequency — 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table)
Supply Voltage — 1.14 V to 1.26 V
Operating Temperature — 0 C to 85 C (commercial)
Package Type — FBGA-676 (PBGA676)
Package Dimensions — 27 mm x 27 mm, 1.0 mm ball pitch
Clock Management — DCM and PLL present
Lead-Free — Yes
RoHS — [DATA_NEEDED: RoHS compliance statement for this exact orderable]
REACH — [DATA_NEEDED: REACH declaration for this exact orderable]
Automotive Grade (AEC-Q100) — Not qualified - commercial temperature grade
Maximum Package Pin Count — 676 balls

Datasheets & Resources

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