XC6SLX100-2FGG676C vs XC6SLX75-3FGG676C 对比

详细并排对比 XC6SLX100-2FGG676C 出自 AMD 和 XC6SLX75-3FGG676C 出自 Xilinx。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 XC6SLX100-2FGG676C XC6SLX75-3FGG676C
品牌 AMD Xilinx
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Family Spartan-6 LX —
Logic Cells 101,261 74,637
System Gates 4,939,776 —
Slices 15,822 —
Block RAM 3.8 Mb (4824 Kbits) 3,096 Kbit
DSP Slices 180 DSP48A1 —
Maximum User I/O 480 —
Maximum I/O Banks 6 —
Speed Grade -2 -3 (highest performance grade)
Temperature Grade Commercial (0 C to +85 C) —
封装 FBGA-676 (FGG676) 27x27 mm —
Ball Pitch 0.8 mm —
Core Voltage 1.2 V —
Process Technology 45 nm CMOS 45 nm CMOS
安装类型 Surface Mount (BGA) Surface Mount
RoHS 状态 Compliant —
Lead Free Yes —
Device Type — FPGA (Field Programmable Gate Array)
FPGA Family — Spartan-6 LX
Configurable Logic Blocks (CLBs) — 5,831
User I/O — 408
DSP48A1 Slices — 132
Internal Frequency — 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table)
电源电压 — 1.14 V to 1.26 V
工作温度 — 0 C to 85 C (commercial)
Package Type — FBGA-676 (PBGA676)
Package Dimensions — 27 mm x 27 mm, 1.0 mm ball pitch
Clock Management — DCM and PLL present
Lead-Free — Yes
RoHS — [DATA_NEEDED: RoHS compliance statement for this exact orderable]
REACH — [DATA_NEEDED: REACH declaration for this exact orderable]
Automotive Grade (AEC-Q100) — Not qualified - commercial temperature grade
Maximum Package Pin Count — 676 balls

数据手册与资源

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