XC6SLX100-3FGG484C vs XC6SLX100-2FG484C Comparison

Detailed side-by-side comparison of XC6SLX100-3FGG484C by AMD and XC6SLX100-2FG484C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX100-3FGG484C XC6SLX100-2FG484C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family Spartan-6 LX —
Logic Cells 101,261 101,261 cells
System Gates 4,939,776 —
User I/O 326 326 I/O
Block RAM 4,824 Kbits (4824 Kb = ~4824 Kbits total Block RAM) [DATA_NEEDED: XC6SLX100-2FG484C block RAM capacity]
DSP48A1 Slices 180 —
Speed Grade -3 (highest performance) -2
Process Node 45 nm CMOS —
Core Voltage (VCCINT) 1.2 V (nominal) —
Package 484-ball FBG (FGG484), 19 x 19 mm, 0.80 mm pitch, Pb-free 484-BBGA
Operating Temperature 0 C to +85 C (C grade, commercial) [DATA_NEEDED: XC6SLX100-2FG484C operating temperature range]
Internal/Max Frequency 667 MHz (memory controller; logic Fmax speed-grade dependent) —
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status Compliant [DATA_NEEDED: XC6SLX100-2FG484C RoHS status]
Lead-Free Status Lead Free —
Device Type — Spartan-6 LX Field-Programmable Gate Array
Total Pins — 484 pins
Temperature Grade — Commercial
Internal Frequency — 667 MHz
Process Technology — 45 nm CMOS
Device Family — Spartan-6 LX
Programming Technology — Field-programmable gate array
Supply Voltage — [DATA_NEEDED: XC6SLX100-2FG484C supply voltage]
DSP Slices — [DATA_NEEDED: XC6SLX100-2FG484C DSP slice count]
Package Dimensions — 19 mm x 19 mm, 0.80 mm pitch
REACH Status — [DATA_NEEDED: XC6SLX100-2FG484C REACH status]

Datasheets & Resources

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