XC6SLX16-2CSG324C vs XC6SLX16-3CSG324C Comparison

Detailed side-by-side comparison of XC6SLX16-2CSG324C by AMD and XC6SLX16-3CSG324C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX16-2CSG324C XC6SLX16-3CSG324C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Field Programmable Gate Array (FPGA) Spartan-6 LX field-programmable gate array
FPGA Family Spartan-6 LX —
Logic Cells 14,579 cells 14,579 cells
I/O Count 232 I/Os —
Internal Frequency 667 MHz 667 MHz
Supply Voltage 1.2 V —
Process Technology 45 nm 45 nm
Speed Grade -2 —
Operating Temperature 0°C to 85°C 0 °C to 85 °C
Package 324-LFBGA/CSPBGA; retrieved sources also state CSBGA-484 324-CSPBGA
Package Dimensions 19 mm x 19 mm —
Package Pitch 0.80 mm —
Lead-Free Status Lead-free package description in retrieved data Lead-free
Manufacturer AMD, formerly Xilinx —
Pin Count 324-ball package designation in distributor listing; retrieved specification also states 484 pins —
Lifecycle Context Spartan-6 family described as mature in retrieved cross-reference material —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH compliance status]
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] [DATA_NEEDED: AEC-Q100 qualification status]
Halogen-Free Status [DATA_NEEDED: halogen-free status] —
Conflict Minerals Status [DATA_NEEDED: conflict-minerals status] —
LABs and CLBs — 1,139 LABs and CLBs
Embedded RAM — 589,824 bits
User I/O — 232 I/O
Operating Supply Voltage — 1.14 V to 1.26 V
Package Ball Count — 324 balls
Mounting Type — Surface Mount
Package Body Dimensions — [DATA_NEEDED: verified CSG324 package body dimensions]
Package Ball Pitch — [DATA_NEEDED: verified CSG324 ball pitch]

Datasheets & Resources

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