XC6SLX16-2CSG324C vs XC6SLX16-3CSG324C 对比
详细并排对比 XC6SLX16-2CSG324C 出自 AMD 和 XC6SLX16-3CSG324C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX16-2CSG324C | XC6SLX16-3CSG324C |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| Device Type | Field Programmable Gate Array (FPGA) | Spartan-6 LX field-programmable gate array |
| FPGA Family | Spartan-6 LX | — |
| Logic Cells | 14,579 cells | 14,579 cells |
| I/O Count | 232 I/Os | — |
| Internal Frequency | 667 MHz | 667 MHz |
| 电源电压 | 1.2 V | — |
| Process Technology | 45 nm | 45 nm |
| Speed Grade | -2 | — |
| 工作温度 | 0°C to 85°C | 0 °C to 85 °C |
| 封装 | 324-LFBGA/CSPBGA; retrieved sources also state CSBGA-484 | 324-CSPBGA |
| Package Dimensions | 19 mm x 19 mm | — |
| Package Pitch | 0.80 mm | — |
| Lead-Free Status | Lead-free package description in retrieved data | Lead-free |
| Manufacturer | AMD, formerly Xilinx | — |
| 引脚数量 | 324-ball package designation in distributor listing; retrieved specification also states 484 pins | — |
| Lifecycle Context | Spartan-6 family described as mature in retrieved cross-reference material | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH compliance status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | [DATA_NEEDED: AEC-Q100 qualification status] |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Conflict Minerals Status | [DATA_NEEDED: conflict-minerals status] | — |
| LABs and CLBs | — | 1,139 LABs and CLBs |
| Embedded RAM | — | 589,824 bits |
| User I/O | — | 232 I/O |
| 工作电源电压 | — | 1.14 V to 1.26 V |
| Package Ball Count | — | 324 balls |
| 安装类型 | — | Surface Mount |
| Package Body Dimensions | — | [DATA_NEEDED: verified CSG324 package body dimensions] |
| Package Ball Pitch | — | [DATA_NEEDED: verified CSG324 ball pitch] |