XC6SLX16-2CSG324C vs XC6SLX16-3CSG324C 비교
다음의 상세 나란히 비교: XC6SLX16-2CSG324C 제조: AMD 및 XC6SLX16-3CSG324C 제조: AMD. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | XC6SLX16-2CSG324C | XC6SLX16-3CSG324C |
|---|---|---|
| 브랜드 | AMD | AMD |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| Device Type | Field Programmable Gate Array (FPGA) | Spartan-6 LX field-programmable gate array |
| FPGA Family | Spartan-6 LX | — |
| Logic Cells | 14,579 cells | 14,579 cells |
| I/O Count | 232 I/Os | — |
| Internal Frequency | 667 MHz | 667 MHz |
| 공급 전압 | 1.2 V | — |
| Process Technology | 45 nm | 45 nm |
| Speed Grade | -2 | — |
| 동작 온도 | 0°C to 85°C | 0 °C to 85 °C |
| 패키지 | 324-LFBGA/CSPBGA; retrieved sources also state CSBGA-484 | 324-CSPBGA |
| Package Dimensions | 19 mm x 19 mm | — |
| Package Pitch | 0.80 mm | — |
| Lead-Free Status | Lead-free package description in retrieved data | Lead-free |
| Manufacturer | AMD, formerly Xilinx | — |
| 핀 수 | 324-ball package designation in distributor listing; retrieved specification also states 484 pins | — |
| Lifecycle Context | Spartan-6 family described as mature in retrieved cross-reference material | — |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH compliance status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | [DATA_NEEDED: AEC-Q100 qualification status] |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Conflict Minerals Status | [DATA_NEEDED: conflict-minerals status] | — |
| LABs and CLBs | — | 1,139 LABs and CLBs |
| Embedded RAM | — | 589,824 bits |
| User I/O | — | 232 I/O |
| 동작 공급 전압 | — | 1.14 V to 1.26 V |
| Package Ball Count | — | 324 balls |
| 실장 유형 | — | Surface Mount |
| Package Body Dimensions | — | [DATA_NEEDED: verified CSG324 package body dimensions] |
| Package Ball Pitch | — | [DATA_NEEDED: verified CSG324 ball pitch] |