XC6SLX25-2FT256I vs XC6SLX25-3FT256I Comparison

Detailed side-by-side comparison of XC6SLX25-2FT256I by AMD and XC6SLX25-3FT256I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX25-2FT256I XC6SLX25-3FT256I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active NRND
Family Spartan-6 LX —
Logic Cells 24,051 24,051 cells
Configurable Logic Blocks (CLBs) 1,879 —
Block RAM (Kbits) 958 —
Distributed RAM (Kbits) 4,824 —
DSP48A1 Slices 38 —
User I/O 186 186 I/O
Clock Management Tiles (CMTs) 2 —
Maximum Internal Frequency 500 MHz 500 MHz
Speed Grade -2 (standard) -3
Temperature Grade -I (Industrial, -40C to +100C) —
Process Technology 45 nm CMOS 45 nm CMOS
Package FTBGA-256 (FT256), 17 x 17 mm, 1.0 mm pitch 256-LBGA, 17 x 17 mm
Supply Voltage (Core) 1.2 V —
Memory Controller Hardened MCB (DDR/DDR2/DDR3/LPDDR up to 800 Mb/s) —
Mounting Type Surface Mount (BGA) —
RoHS Status Compliant (Pb-free) Compliant
Device Type — Field Programmable Gate Array (FPGA)
Device Family — Spartan-6 LX
Configurable Logic Blocks — 1,879 CLBs
Adaptive Logic Modules — 3,758 ALMs
Embedded Memory — 936 kbit
Core Supply Voltage — 1.2 V
Package Pitch — [DATA_NEEDED: package ball pitch]
Operating Temperature — 0°C to 85°C
Termination — Lead-free
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]

Datasheets & Resources

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