XC6SLX25-2FT256I vs XC6SLX25-3FT256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX25-2FT256I sa pamamagitan ng AMD at XC6SLX25-3FT256I sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | XC6SLX25-2FT256I | XC6SLX25-3FT256I |
|---|---|---|
| Brand | AMD | AMD |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Spartan-6 LX | — |
| Logic Cells | 24,051 | 24,051 cells |
| Configurable Logic Blocks (CLBs) | 1,879 | — |
| Block RAM (Kbits) | 958 | — |
| Distributed RAM (Kbits) | 4,824 | — |
| DSP48A1 Slices | 38 | — |
| User I/O | 186 | 186 I/O |
| Clock Management Tiles (CMTs) | 2 | — |
| Maximum Internal Frequency | 500 MHz | 500 MHz |
| Speed Grade | -2 (standard) | -3 |
| Temperature Grade | -I (Industrial, -40C to +100C) | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Packhaging | FTBGA-256 (FT256), 17 x 17 mm, 1.0 mm pitch | 256-LBGA, 17 x 17 mm |
| Supply Voltage (Core) | 1.2 V | — |
| Memory Controller | Hardened MCB (DDR/DDR2/DDR3/LPDDR up to 800 Mb/s) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Tindminan RoHS | Compliant (Pb-free) | Compliant |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | Spartan-6 LX |
| Configurable Logic Blocks | — | 1,879 CLBs |
| Adaptive Logic Modules | — | 3,758 ALMs |
| Embedded Memory | — | 936 kbit |
| Core Supply Voltage | — | 1.2 V |
| Package Pitch | — | [DATA_NEEDED: package ball pitch] |
| Temperature na Operasyon | — | 0°C to 85°C |
| Termination | — | Lead-free |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |