XC6SLX25-2FT256I vs XC6SLX25-3FT256I Vergleich
Detaillierter Direktvergleich von XC6SLX25-2FT256I von AMD und XC6SLX25-3FT256I von AMD. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | XC6SLX25-2FT256I | XC6SLX25-3FT256I |
|---|---|---|
| Marke | AMD | AMD |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Family | Spartan-6 LX | — |
| Logic Cells | 24,051 | 24,051 cells |
| Configurable Logic Blocks (CLBs) | 1,879 | — |
| Block RAM (Kbits) | 958 | — |
| Distributed RAM (Kbits) | 4,824 | — |
| DSP48A1 Slices | 38 | — |
| User I/O | 186 | 186 I/O |
| Clock Management Tiles (CMTs) | 2 | — |
| Maximum Internal Frequency | 500 MHz | 500 MHz |
| Speed Grade | -2 (standard) | -3 |
| Temperature Grade | -I (Industrial, -40C to +100C) | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Gehäuse | FTBGA-256 (FT256), 17 x 17 mm, 1.0 mm pitch | 256-LBGA, 17 x 17 mm |
| Supply Voltage (Core) | 1.2 V | — |
| Memory Controller | Hardened MCB (DDR/DDR2/DDR3/LPDDR up to 800 Mb/s) | — |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant (Pb-free) | Compliant |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | Spartan-6 LX |
| Configurable Logic Blocks | — | 1,879 CLBs |
| Adaptive Logic Modules | — | 3,758 ALMs |
| Embedded Memory | — | 936 kbit |
| Core Supply Voltage | — | 1.2 V |
| Package Pitch | — | [DATA_NEEDED: package ball pitch] |
| Betriebstemperatur | — | 0°C to 85°C |
| Termination | — | Lead-free |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |