XC6SLX45-2FG676I vs XC6SLX45-2FGG676C Comparison

Detailed side-by-side comparison of XC6SLX45-2FG676I by AMD and XC6SLX45-2FGG676C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX45-2FG676I XC6SLX45-2FGG676C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX Field Programmable Gate Array (FPGA) —
Logic Cells 43,661 cells 43,661
I/O Count 358 I/O —
Technology 45 nm CMOS —
Core Supply Voltage 1.2 V —
Speed Grade -2 -2 (standard performance)
Temperature Grade Industrial —
Package 676-BGA 676-ball FFG / FBGA, 27 x 27 mm, 1.0 mm pitch
Package Type BGA —
Number of Terminals 676 —
Package Shape Square —
Terminal Form Ball —
Programmable Logic Type FPGA —
Manufacturer AMD / Xilinx —
RoHS Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Maximum Clock Frequency [DATA_NEEDED: maximum clock frequency] —
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Resources [DATA_NEEDED: DSP resource count] —
Device Family — Spartan-6 LX
Block RAM (bits) — 2,138,112
User I/O Count — 358
Number of CLBs — 3,411
Process Technology — 45 nm CMOS, low-power copper
Core Voltage (Vccint) — 1.2 V nominal (1.14 V to 1.26 V range)
Auxiliary Voltage (Vccaux) — 2.5 V nominal
I/O Bank Voltage (Vcco) — 1.2 V to 3.3 V per bank
Operating Temperature — 0 C to +85 C (commercial, "C" suffix)
Mounting Type — Surface Mount (BGA)
MSL Level — 3 (168 hours)
Lead Free / REACH — Lead free per MO-275

Datasheets & Resources

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