XC6SLX45-2FG676I vs XC6SLX45-2FGG676C 对比
详细并排对比 XC6SLX45-2FG676I 出自 AMD 和 XC6SLX45-2FGG676C 出自 AMD。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | XC6SLX45-2FG676I | XC6SLX45-2FGG676C |
|---|---|---|
| 品牌 | AMD | AMD |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| Device Type | Spartan-6 LX Field Programmable Gate Array (FPGA) | — |
| Logic Cells | 43,661 cells | 43,661 |
| I/O Count | 358 I/O | — |
| Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Speed Grade | -2 | -2 (standard performance) |
| Temperature Grade | Industrial | — |
| 封装 | 676-BGA | 676-ball FFG / FBGA, 27 x 27 mm, 1.0 mm pitch |
| Package Type | BGA | — |
| Number of Terminals | 676 | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Programmable Logic Type | FPGA | — |
| Manufacturer | AMD / Xilinx | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| 工作温度范围 | [DATA_NEEDED: operating temperature range] | — |
| 最大时钟频率 | [DATA_NEEDED: maximum clock frequency] | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Resources | [DATA_NEEDED: DSP resource count] | — |
| Device Family | — | Spartan-6 LX |
| Block RAM (bits) | — | 2,138,112 |
| User I/O Count | — | 358 |
| Number of CLBs | — | 3,411 |
| Process Technology | — | 45 nm CMOS, low-power copper |
| Core Voltage (Vccint) | — | 1.2 V nominal (1.14 V to 1.26 V range) |
| Auxiliary Voltage (Vccaux) | — | 2.5 V nominal |
| I/O Bank Voltage (Vcco) | — | 1.2 V to 3.3 V per bank |
| 工作温度 | — | 0 C to +85 C (commercial, "C" suffix) |
| 安装类型 | — | Surface Mount (BGA) |
| MSL 等级 | — | 3 (168 hours) |
| Lead Free / REACH | — | Lead free per MO-275 |