XC6SLX75-3FGG484C vs XC6SLX100-3FGG484C Comparison
Detailed side-by-side comparison of XC6SLX75-3FGG484C by AMD and XC6SLX100-3FGG484C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX75-3FGG484C | XC6SLX100-3FGG484C |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | Spartan-6 LX | — |
| Logic Cells | 74,637 | 101,261 |
| User I/O Count | 280 | — |
| Package Type | 484-ball FBGA (MS-034) | — |
| Package Body Size | 23 x 23 mm | — |
| Package Pitch | 1.0 mm | — |
| Internal Clock Frequency | 667 MHz | — |
| Speed Grade | -3 (highest performance in Spartan-6 LX family) | -3 (highest performance) |
| Operating Temperature Range | 0 °C to 85 °C (commercial grade) | — |
| Mounting Type | Surface Mount (SMD) | Surface Mount (BGA) |
| Supply Voltage | [DATA_NEEDED: supply voltage range] | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | 4,824 Kbits (4824 Kb = ~4824 Kbits total Block RAM) |
| DSP Slices | [DATA_NEEDED: DSP48A slice count] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory type] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards per bank] | — |
| Manufacturer | AMD (formerly Xilinx) | — |
| RoHS Status | unknown | Compliant |
| Order Code Suffix | C = commercial temperature grade | — |
| Family | — | Spartan-6 LX |
| System Gates | — | 4,939,776 |
| User I/O | — | 326 |
| DSP48A1 Slices | — | 180 |
| Process Node | — | 45 nm CMOS |
| Core Voltage (VCCINT) | — | 1.2 V (nominal) |
| Package | — | 484-ball FBG (FGG484), 19 x 19 mm, 0.80 mm pitch, Pb-free |
| Operating Temperature | — | 0 C to +85 C (C grade, commercial) |
| Internal/Max Frequency | — | 667 MHz (memory controller; logic Fmax speed-grade dependent) |
| Lead-Free Status | — | Lead Free |