XC7K325T-2FFG900C vs XC7K325T-2FFG900I Comparison

Detailed side-by-side comparison of XC7K325T-2FFG900C by AMD and XC7K325T-2FFG900I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC7K325T-2FFG900C XC7K325T-2FFG900I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family Kintex-7 Kintex-7
Number of Logic Cells 326080 —
Number of CLB Flip-Flops 407600 —
Maximum Distributed RAM 16404480 bits —
Number of DSP48E1 Slices 840 —
Total Memory (Block RAM) 16024640 bits —
Number of GTX Transceivers 16 —
Maximum User I/O 500 —
Speed Grade -2 -2
Core Voltage (VCCINT) 970 mV to 1.03 V 1.0V
Maximum Fabric Frequency 470.37 MHz —
Operating Temperature 0C to +85C (commercial) —
Package 900-BBGA, FCBGA (FFG900), 30x30 mm, 1.0 mm pitch 900-BBGA, FCBGA
Process Technology 28 nm HKMG 28nm
Clock Management MMCM + PLL —
XADC Dual 12-bit 1 MSPS with +/-1% internal reference —
Mounting Type Surface Mount Surface Mount
RoHS Status [DATA_NEEDED: RoHS status] Compliant
Logic Cells — 326080
Block RAM — 16404480 bits
DSP Slices — 840
User I/O — 500
Temperature Grade — Industrial (-40°C to +100°C)
I/O Standards — LVCMOS, LVDS, HSTL, SSTL
Transceivers — 16 (GTX)
PCIe Support — Gen3

Datasheets & Resources

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