XC7K325T-2FFG900I - Kintex-7 FPGA 326K Logic Cells | AMD
MPN: XC7K325T-2FFG900I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $81.05 | $81.05 |
| 10 | $76.5 | $765.00 |
| 100 | $72 | $7,200.00 |
| 500 | $68.5 | $34,250.00 |
| 1,000 | $65 | $65,000.00 |
Drop-in alternatives for XC7K325T-2FFG900I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7K325T-2FFG900C
β Drop-Inπ Reference alternative (not in catalog)
XC7K325T-1FFG900I
β Drop-Inπ Reference alternative (not in catalog)
XC7K325T-L2FFG900I
β Drop-Inπ Reference alternative (not in catalog)
XC7K325T-3FFG900I
β Drop-Inπ Reference alternative (not in catalog)
CWC2P300T-FFG900I
β Drop-Inπ Reference alternative (not in catalog)
XC7K325T-2FFG900I Maximum Ratings & Electrical Characteristics
| Family | Kintex-7 |
| Logic Cells | 326080 |
| Block RAM | 16404480 bits |
| DSP Slices | 840 |
| User I/O | 500 |
| Package | 900-BBGA, FCBGA |
| Speed Grade | -2 |
| Temperature Grade | Industrial (-40Β°C to +100Β°C) |
| Process Technology | 28nm |
| Core Voltage (VCCINT) | 1.0V |
| I/O Standards | LVCMOS, LVDS, HSTL, SSTL |
| Transceivers | 16 (GTX) |
| PCIe Support | Gen3 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
XC7K325T-2FFG900I Pin Configuration
| Pin A1 | GND β Ground |
| Pin A2 | VCCO_0 β I/O bank 0 supply voltage |
| Pin A3 | IO_L1P_T0_0 β User I/O, bank 0 |
| Pin B1 | VCCINT β Core supply voltage |
| Pin B2 | IO_L1N_T0_0 β User I/O, bank 0 |
| Pin C1 | VCCAUX β Auxiliary supply voltage |
| Pin C2 | IO_L2P_T0_0 β User I/O, bank 0 |
| Pin D1 | GND β Ground |
| Pin D2 | IO_L2N_T0_0 β User I/O, bank 0 |
| Pin E1 | VCCINT β Core supply voltage |
| Pin E2 | IO_L3P_T0_0 β User I/O, bank 0 |
| Pin F1 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7K325T-2FFG900I is suitable for 6 applications: Software-Defined Radio, Medical Imaging, Video Processing, Data Center Acceleration, Aerospace and Defense, Wired Communications.
Software-Defined Radio
The XC7K325T-2FFG900I is ideal for software-defined radio (SDR) systems due to its 840 DSP slices and 16.4 Mb of block RAM, which enable complex digital signal processing algorithms. Its support for high-speed serial transceivers allows direct interfacing with RF front-ends, while the industrial temperature grade ensures reliable operation in field environments. The device's reconfigurability allows over-the-air updates to signal processing chains, making it a flexible platform for evolving communication standards.
Recommended
Medical Imaging
In medical imaging systems such as ultrasound and CT scanners, the XC7K325T-2FFG900I provides the high DSP throughput needed for real-time image reconstruction and processing. Its 840 DSP slices can implement beamforming and filtering algorithms, while the 500 user I/O pins interface with high-speed ADCs and DACs. The industrial temperature grade supports operation in clinical environments where reliability is critical. The device's reconfigurability allows algorithm updates without hardware changes.
Recommended
Video Processing
The XC7K325T-2FFG900I is well-suited for video processing applications, including broadcast equipment and video surveillance systems. Its 326,080 logic cells can implement complex video codecs and image enhancement algorithms, while the 16.4 Mb of block RAM supports line buffering and frame storage. The device's support for multiple I/O standards enables interfacing with HDMI, DisplayPort, and SDI transceivers. The -2 speed grade provides sufficient performance for 4K video processing at 60 fps.
Recommended
Data Center Acceleration
In data center applications, the XC7K325T-2FFG900I can accelerate workloads such as network packet processing, storage controllers, and search engines. Its support for PCIe Gen3 enables high-bandwidth host communication, while the 840 DSP slices accelerate encryption and compression algorithms. The 500 user I/O pins allow flexible interfacing with memory and network devices. The device's reconfigurability enables workload-specific acceleration without dedicated ASICs.
Recommended
Aerospace and Defense
The XC7K325T-2FFG900I is designed for aerospace and defense applications, including radar, electronic warfare, and secure communications. Its industrial temperature grade (-40Β°C to +100Β°C) ensures operation in harsh environments, while the 28nm process provides high performance with manageable power consumption. The device's 840 DSP slices enable real-time signal processing, and its reconfigurability allows field updates to adapt to changing mission requirements.
Recommended
Wired Communications
The XC7K325T-2FFG900I is suitable for wired communications equipment, including switches, routers, and base stations. Its support for 10 Gigabit Ethernet and PCIe Gen3 enables high-throughput data paths, while the 500 user I/O pins interface with PHY devices and network processors. The device's 326,080 logic cells can implement packet processing and traffic management functions. The -2 speed grade provides a balance of performance and power for line-rate processing.
Recommended
Recommended Products Summary
Engineering reference data for XC7K325T-2FFG900I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7K325T-2FFG900C | XC7K325T-1FFG900I | XC7K325T-L2FFG900I | XC7K325T-3FFG900I | CWC2P300T-FFG900I |
|---|---|---|---|---|---|---|
| Package | 900-BBGA, FCBGA | 900-BBGA, FCBGA - same | 900-BBGA, FCBGA - same | 900-BBGA, FCBGA - same | 900-BBGA, FCBGA - same | 900-BBGA, FCBGA - same |
| Brand | AMD | AMD | AMD | AMD | AMD | Chengdu Sinochip |
| Logic Cells | 326080 | 326080 | 326080 | 326080 | 326080 | [DATA_NEEDED] |
| Block RAM | 16404480 bits | 16404480 bits | 16404480 bits | 16404480 bits | 16404480 bits | [DATA_NEEDED] |
| DSP Slices | 840 | 840 | 840 | 840 | 840 | [DATA_NEEDED] |
| User I/O | 500 | 500 | 500 | 500 | 500 | [DATA_NEEDED] |
| Speed Grade | -2 | -2 | -1 | -2L | -3 | [DATA_NEEDED] |
| Temperature Grade | Industrial (-40Β°C to +100Β°C) | Commercial (0Β°C to +85Β°C) | Industrial (-40Β°C to +100Β°C) | Industrial (-40Β°C to +100Β°C) | Industrial (-40Β°C to +100Β°C) | [DATA_NEEDED] |
Key Differentiators
- Industrial temperature grade (vs XC7K325T-2FFG900C)
- Balanced -2 speed grade (vs XC7K325T-1FFG900I)
- Standard power vs low-power (vs XC7K325T-L2FFG900I)
Design Notes
The XC7K325T-2FFG900I requires multiple supply rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (varies by I/O bank). Use a dedicated power management solution with proper sequencing. Refer to the Kintex-7 power management application note for recommended power-up sequences and decoupling capacitor values. Ensure adequate bulk capacitance on each rail to handle transient currents during configuration and operation.
The XC7K325T-2FFG900I can dissipate significant power, especially at high utilization and clock speeds. The 900-ball FCBGA package has a thermal resistance that requires a heatsink or forced airflow for reliable operation. Calculate the junction temperature using the device's power dissipation and thermal resistance, and ensure it stays below the maximum rating of 100Β°C for industrial grade. Consider using a thermal pad and heatsink for high-power designs.
For high-speed I/O and transceiver signals, follow the PCB layout guidelines in the Kintex-7 PCB design guide. Use controlled impedance traces for differential pairs, and place decoupling capacitors close to the FPGA power pins. For the 900-ball FCBGA package, use a multi-layer PCB with dedicated power and ground planes. Refer to the AMD package pinout files for exact ball assignments and routing guidance.
Compliance Information
RoHS compliant per datasheet directory. AEC-Q100 not applicable for FPGA. Other compliance data not specified in provided sources.
