XC7K325T-2FFG900C vs XC7K325T-2FFG900I Comparación
Comparación detallada lado a lado de XC7K325T-2FFG900C por AMD y XC7K325T-2FFG900I por AMD. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | XC7K325T-2FFG900C | XC7K325T-2FFG900I |
|---|---|---|
| Marca | AMD | AMD |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.590,00 | $65,00 |
| Family | Kintex-7 | Kintex-7 |
| Number of Logic Cells | 326080 | — |
| Number of CLB Flip-Flops | 407600 | — |
| Maximum Distributed RAM | 16404480 bits | — |
| Number of DSP48E1 Slices | 840 | — |
| Total Memory (Block RAM) | 16024640 bits | — |
| Number of GTX Transceivers | 16 | — |
| Maximum User I/O | 500 | — |
| Speed Grade | -2 | -2 |
| Core Voltage (VCCINT) | 970 mV to 1.03 V | 1.0V |
| Maximum Fabric Frequency | 470.37 MHz | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Encapsulado | 900-BBGA, FCBGA (FFG900), 30x30 mm, 1.0 mm pitch | 900-BBGA, FCBGA |
| Process Technology | 28 nm HKMG | 28nm |
| Clock Management | MMCM + PLL | — |
| XADC | Dual 12-bit 1 MSPS with +/-1% internal reference | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Logic Cells | — | 326080 |
| Block RAM | — | 16404480 bits |
| DSP Slices | — | 840 |
| User I/O | — | 500 |
| Temperature Grade | — | Industrial (-40°C to +100°C) |
| I/O Standards | — | LVCMOS, LVDS, HSTL, SSTL |
| Transceivers | — | 16 (GTX) |
| PCIe Support | — | Gen3 |