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XC7A75T-3FGG676E - 75,520-Cell Artix-7 FPGA | AMD
XC7A75T-3FGG676E

XC7A75T-3FGG676E - 75,520-Cell Artix-7 FPGA | AMD

AMD XC7A75T-3FGG676E is an Artix-7 field-programmable gate array with 75,520 logic cells, 28 nm CMOS technology, a 1 V supply, 300 user I/Os, and a 676-pin FBGA package. It combines programmable logic resources with high-speed parallel I/O in a package designated FGG676, supplied in a tray according to the verified distributor data. An FPGA is a programmable logic device in the semiconductor hierarchy. Its configurable logic blocks, block RAM, programmable I/O, and dedicated resources allow engineers to implement digital systems that would otherwise require combinations of fixed-function ICs. Artix-7 belongs to the FPGA and CPLD family of programmable logic devices, positioned between simpler programmable logic and larger system-on-chip devices. The XC7A75T provides 75,520 logic cells and 300 user I/Os. Its 28 nm CMOS process supports a 1 V operating supply, while the -3 ordering designation identifies the performance grade of this device. The FGG676 package provides 676 package balls and, according to the verified source, uses a 1.0 mm ball pitch on a 27 mm square footprint. These characteristics make the device suitable for designs requiring substantial parallel connectivity. The device is intended for industrial, communications, instrumentation, embedded processing, and high-speed digital interface applications. A representative implementation could use configurable logic for protocol conversion, embedded RAM for buffering, and programmable I/O for acquisition or control interfaces. Because the exact resources for each Artix-7 speed and package combination are organized by device variant, engineers should confirm the applicable Artix-7 data sheet and package files during design review. The extended-temperature order suffix E makes this part relevant to designs requiring operation beyond the usual commercial temperature envelope, but the exact junction and ambient limits must be selected from the manufacturer ordering guide. Commercial, industrial, and extended-temperature variants can share a package while differing in qualification and temperature requirements. A critical hardware consideration is that the 676-ball FBGA package has a fine 1.0 mm ball pitch. PCB escape routing must be designed with the manufacturer package symbol, differential-pair geometry, power planes, and via requirements taken directly from the package design files. Thermal performance also depends on multilayer construction, copper distribution, airflow, and the adjacent heat-spreader or thermal-interface strategy. This page consolidates verified package, process, logic-cell, I/O, and sourcing information while explicitly separating unavailable electrical details. It also provides same-family migration comparisons, practical PCB guidance, and a structured selection framework for engineers evaluating the XC7A75T-3FGG676E against other Artix-7 speed, temperature, and package options.

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XC7K160T-2FFG676I - Kintex-7 FPGA 162K Logic Cells | AMD
XC7K160T-2FFG676I

XC7K160T-2FFG676I - Kintex-7 FPGA 162K Logic Cells | AMD

The AMD XC7K160T-2FFG676I is a Kintex-7 family Field Programmable Gate Array (FPGA) delivering 162,240 logic cells, 400 user I/Os, and 11,980,800 bits of block RAM in a 676-ball FCBGA package. It operates over the industrial temperature range of -40°C to +100°C and is lead-free / RoHS compliant. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the designer after manufacturing, enabling custom digital logic implementations without the cost and lead time of ASIC development. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which range from simple CPLDs to high-capacity FPGAs, and are essential in applications requiring parallel processing, rapid prototyping, and field-updatable hardware. Key features of the XC7K160T-2FFG676I include the -2 speed grade, which balances performance and power consumption, and the FFG676 package that supports easy migration between Kintex-7 family members. The device provides 400 user I/Os, 10 clock management tiles (CMTs) with MMCM and PLL, and 600 DSP slices for high-throughput signal processing. Its 36 Kb block RAM blocks total 11,980,800 bits, enabling substantial on-chip data storage. Architecturally, the Kintex-7 series is built on a 28 nm high-k metal gate (HKMG) process, offering a strong balance of performance, power, and cost. The -2 speed grade provides a middle ground between the higher-performance -3 and the lower-power -1L/-2L variants. The device supports a wide range of I/O standards, including LVCMOS, LVDS, and HSTL, and includes integrated PCIe, Gigabit transceivers, and DDR3/DDR4 memory interfaces. Typical applications include high-performance signal processing, software-defined radio, medical imaging, aerospace and defense systems, and wired communications. The 400 I/Os and 162K logic cells make it suitable for complex digital designs requiring substantial parallel processing and connectivity. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The FCBGA package requires a well-designed PCB with adequate thermal vias and a solid ground plane to ensure reliable operation at industrial temperatures.

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XC7K160T-3FFG676E - Kintex-7 FPGA 162K Cells | AMD
XC7K160T-3FFG676E

XC7K160T-3FFG676E - Kintex-7 FPGA 162K Cells | AMD

The AMD XC7K160T-3FFG676E is a high-performance Kintex®-7 Field Programmable Gate Array (FPGA) from the Kintex-7 family, fabricated on a 28nm process technology. It features 162,240 logic cells, 400 user I/O pins, and 11,980,800 bits of block RAM, all housed in a 676-ball FCBGA (27x27mm) package. This device is the -3 speed grade, the highest performance option in the Kintex-7 lineup, offering maximum clock frequencies and throughput for demanding applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. Unlike fixed-function ASICs, FPGAs contain a fabric of programmable logic blocks, interconnects, and I/O elements that can be reprogrammed in the field, making them ideal for prototyping, high-performance computing, and applications requiring hardware flexibility. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which also includes CPLDs, and are a key component in the semiconductor industry for accelerating workloads that benefit from parallel processing. Key features of the XC7K160T-3FFG676E include 400 user I/O pins supporting various I/O standards, 11,980,800 bits of block RAM for on-chip data storage, and 400 DSP slices for high-speed digital signal processing. The -3 speed grade provides the highest performance, with internal clock speeds exceeding 600 MHz. The device also supports PCIe® Gen2, Gigabit Ethernet, and other high-speed serial transceivers, making it suitable for a wide range of communication and processing tasks. Technically, the Kintex-7 family is optimized for best price-performance, offering a 2X improvement over the previous generation. The 28nm high-k metal gate (HKMG) process technology enables low power consumption while maintaining high logic density. The device includes advanced clock management tiles (CMTs) with PLLs and MMCMs for precise clock generation, and supports partial reconfiguration for dynamic logic updates. Typical applications include software-defined radio (SDR), medical imaging, aerospace and defense systems, and high-performance computing. The XC7K160T-3FFG676E is particularly well-suited for applications requiring high-speed data processing, such as radar signal processing and video/image processing, where its combination of logic density, DSP capability, and high-speed transceivers provides a competitive advantage. When designing with this device, ensure proper power supply decoupling on VCCINT, VCCAUX, and VCCO rails, and follow AMD's recommended PCB layout guidelines for high-speed signals. The device requires a 1.0V core voltage (VCCINT) and supports various I/O bank voltages (VCCO) depending on the interface standard.

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XC7K325T-1FBG676C - Kintex-7 FPGA 326K Logic Cells | AMD
XC7K325T-1FBG676C

XC7K325T-1FBG676C - Kintex-7 FPGA 326K Logic Cells | AMD

The AMD XC7K325T-1FBG676C is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) built on 28nm technology, offering 326,080 logic cells and 400 user I/Os in a 676-ball FCBGA package. It operates from a 1.0V core voltage and supports mainstream standards like PCIe, making it a cost-effective choice for high-bandwidth applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit between ASICs (application-specific) and microprocessors (fixed-function) in the design hierarchy, offering reconfigurability and parallel processing. The Kintex-7 family is optimized for price/performance/watt, balancing logic density, DSP capability, and transceiver performance for mid-range to high-end applications. Key features include 400 I/O pins, 16,404,480 bits of block RAM, and 326,080 logic cells. The device supports multiple speed grades (-1, -2, -3) and includes hardened blocks for PCIe, Gigabit Ethernet, and DDR3 memory controllers. The 676-ball FCBGA package provides excellent thermal and electrical performance for high-speed designs. Architecturally, the Kintex-7 uses a 6-input look-up table (LUT) fabric with dedicated carry chains, DSP48E1 slices for multiply-accumulate operations, and configurable block RAM. The device integrates Clock Management Tiles (CMTs) with MMCM and PLL for precise clock generation. The 28nm HPL process enables low static power while maintaining high performance. Typical applications include software-defined radio, high-performance computing, video processing, and aerospace/defense systems. The device's high DSP ratio and transceiver capabilities make it ideal for signal processing and data acquisition. Its support for PCIe Gen2 and DDR3 simplifies system integration. When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The core voltage must be maintained within 0.97V to 1.03V, and the FCBGA package requires a proper thermal solution for high utilization designs.

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XC7K325T-1FF676I - Kintex-7 FPGA 326K Logic Cells | AMD
XC7K325T-1FF676I

XC7K325T-1FF676I - Kintex-7 FPGA 326K Logic Cells | AMD

The AMD XC7K325T-1FF676I is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It features 326,080 logic cells, 400 I/O pins, and 16,404,480 bits of block RAM, all housed in a 676-ball FCBGA package. This device operates with a core voltage of 1V and supports a wide range of I/O standards, making it suitable for demanding applications in aerospace, defense, automotive, and industrial sectors. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be reprogrammed to implement any digital logic function. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are part of the semiconductor integrated circuit family. This flexibility allows engineers to prototype, iterate, and deploy custom hardware solutions without the high upfront costs of ASIC development. Key features of the XC7K325T-1FF676I include its 326,080 logic cells, which provide substantial capacity for complex digital designs. The device also integrates 840 DSP slices for high-speed digital signal processing, and 16,404,480 bits of block RAM for on-chip data storage. With 400 user I/O pins, it offers extensive connectivity options. The -1 speed grade indicates a balanced performance level, suitable for a wide range of applications without the higher power consumption of faster grades. Technically, the Kintex-7 family is built on AMD's 28nm high-k metal gate (HKMG) process, offering an optimal balance of performance, power, and cost. The device supports PCIe Gen3, 10 Gigabit Ethernet, and other mainstream standards, making it a versatile choice for system integration. The FCBGA-676 package provides excellent thermal and electrical characteristics, with a square body and ball grid array terminals for reliable surface-mount assembly. Typical applications include software-defined radio, high-performance computing, medical imaging, and wired/wireless communications infrastructure. The XC7K325T's high DSP ratio and cost-effective packaging make it particularly well-suited for signal processing and data-intensive tasks. Its support for mainstream standards like PCIe Gen3 and 10 Gigabit Ethernet simplifies integration into existing systems. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (1V core, 1.8V and 3.3V I/O), and proper sequencing is essential. Adequate PCB layout with sufficient copper planes and decoupling capacitors is critical to ensure reliable operation at high speeds.

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XC7K325T-1FFG676C - Kintex-7 FPGA 326K Cells | AMD
XC7K325T-1FFG676C

XC7K325T-1FFG676C - Kintex-7 FPGA 326K Cells | AMD

The AMD XC7K325T-1FFG676C is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process, offering 326,080 logic cells, 400 user I/Os, and 16,404,480 bits of block RAM in a 676-pin FCBGA package. It operates from a 1.0V core supply (0.97V to 1.03V range) and supports mainstream standards including PCIe Gen3 and 10 Gigabit Ethernet. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of application-specific integrated circuits (ASICs) but offer reconfigurability. The Kintex-7 family is positioned as the best price/performance/watt balance in the 7-series, bridging the gap between the low-cost Artix-7 and the high-end Virtex-7. Key features include 840 DSP48E1 slices for high-throughput signal processing, 500 MHz maximum clock frequency, and support for DDR3 memory interfaces. The device integrates 10.3 Gbps transceivers (GTX) for high-speed serial communication, and includes hardened blocks for PCIe Gen3 and 10G Ethernet MAC. The -1 speed grade provides a balanced performance point, while the C temperature grade supports commercial operation from 0°C to 85°C. Architecturally, the Kintex-7 uses a 6-input look-up table (LUT) fabric with 203,800 LUTs, organized into configurable logic blocks (CLBs). The device includes 10 clock management tiles (CMTs) with mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs) for flexible clock generation. The 28nm high-k metal gate (HKMG) process technology delivers up to 50% lower power than previous generations while maintaining high logic density. Typical applications include software-defined radio, high-performance computing acceleration, video and image processing, and wired communications infrastructure. The 400 I/Os support a wide range of I/O standards including LVCMOS, LVDS, and HSTL, making it versatile for board-level integration. When designing with this device, careful attention to power supply decoupling is essential. The core voltage must be regulated to 1.0V with adequate bypass capacitance, and the configuration bitstream must be loaded from an external SPI flash or via JTAG. Thermal management is critical at high utilization; a heatsink or forced airflow is recommended for sustained operation above 50% logic utilization.

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XC7K325T-2FBG676C - Kintex-7 FPGA 326K Logic Cells | AMD
XC7K325T-2FBG676C

XC7K325T-2FBG676C - Kintex-7 FPGA 326K Logic Cells | AMD

The AMD XC7K325T-2FBG676C is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) from the 7 series family, built on advanced 28nm process technology. It delivers 326,080 logic cells, 400 user I/Os, and 16,404,480 total RAM bits, packaged in a 676-ball FCBGA (27x27 mm) with a lidless design. This device operates over a commercial temperature range of 0°C to 85°C (TJ) and supports core voltages around 1V, making it a versatile choice for a wide range of high-bandwidth and signal processing applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, configurable I/O, and routing resources that can be programmed to implement any digital logic function. The Kintex-7 family sits in the mid-range of the 7 series, balancing logic capacity, DSP slices, and transceiver performance to address applications from cost-sensitive, high-volume systems to ultra high-end connectivity and signal processing. This places the XC7K325T within the hierarchy of FPGA -> programmable logic device -> integrated circuit -> semiconductor. Key features of the XC7K325T-2FBG676C include 400 user I/O pins, 25475 Configurable Logic Blocks (CLBs), and 326,080 logic elements/cells. The device also integrates 16,404,480 bits of block RAM, enabling substantial on-chip data storage for buffering and processing. The -2 speed grade offers a balanced performance point, with the -3 grade being the highest performance and -1/-1L for lower power. The 676-FCBGA package provides a compact footprint while supporting the high pin count required for parallel interfaces and memory controllers. From a technical architecture perspective, the Kintex-7 family is built on a 28nm high-k metal gate (HKMG) process, offering a strong price/performance/watt ratio. The device includes hardened blocks such as DSP48E1 slices for high-speed arithmetic, and supports mainstream standards like PCIe Gen3 and 10 Gigabit Ethernet via its high-speed transceivers. The lidless FCBGA package aids in thermal management, allowing direct heatsink attachment for improved heat dissipation in high-power designs. Typical applications for the XC7K325T-2FBG676C include software-defined radio, high-performance computing, medical imaging, and aerospace/defense systems. Its combination of logic density, DSP capability, and I/O count makes it suitable for implementing complex digital signal processing chains, protocol bridging, and parallel processing architectures. The device is also commonly used in development boards like the QMTECH XC7K325T for prototyping and algorithm validation. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) with appropriate filtering, and the lidless package should be paired with a suitable heatsink for applications exceeding moderate power dissipation. Refer to the AMD 7 Series FPGAs datasheet and UG475 for detailed pinout and power requirements.

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XC7K325T-2FFG676I - Kintex-7 FPGA 326K Logic Cells | AMD
XC7K325T-2FFG676I

XC7K325T-2FFG676I - Kintex-7 FPGA 326K Logic Cells | AMD

The AMD XC7K325T-2FFG676I is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process, offering an optimal balance of price, performance, and power for a wide range of applications. It features 326,080 logic cells, 400 user I/Os, and 16,404,480 bits of block RAM, all housed in a 676-ball FCBGA package. This device supports mainstream standards such as PCIe Gen3 and 10 Gigabit Ethernet, making it a versatile choice for high-speed serial connectivity and data processing. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the hardware to be customized to perform specific functions. This flexibility makes FPGAs ideal for prototyping, low-to-mid volume production, and applications requiring hardware acceleration or frequent design updates. The Kintex-7 family sits within the broader FPGA hierarchy, offering a balance between the cost-optimized Artix-7 and the high-performance Virtex-7 families. Key features of the XC7K325T-2FFG676I include 840 DSP slices for high-throughput digital signal processing, 500 I/O pins (400 user I/Os), and support for a core voltage of 0.97V to 1.03V. The device operates at a maximum frequency of 470.37 MHz and includes advanced clock management tiles (CMTs) with MMCM and PLL for precise clock generation. The -2 speed grade provides a strong balance between performance and power consumption, making it suitable for a wide range of high-speed applications. Technically, the Kintex-7 architecture integrates a 28nm high-k metal gate (HKMG) process, enabling high logic density and low power. The device includes hardened memory controllers, high-speed transceivers, and PCIe blocks, reducing the need for external components and simplifying system design. The 676-ball FCBGA package offers excellent thermal and electrical performance, supporting the high I/O count and high-speed interfaces required for demanding applications. Typical applications include software-defined radio, high-performance computing, medical imaging, and aerospace and defense systems. The device's high DSP ratio and support for 10G Ethernet make it particularly well-suited for signal processing and high-throughput data acquisition. Its cost-effective packaging and mainstream standard support also make it a popular choice for communications infrastructure and test and measurement equipment. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The core voltage must be maintained within the specified range, and adequate cooling should be provided to keep the junction temperature within limits. The device's configuration interface should be planned early in the design to ensure reliable programming and reconfiguration.

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XC7K325T-2FFG900C - Kintex-7 FPGA 326K Cells FCBGA-900 | AMD
XC7K325T-2FFG900C

XC7K325T-2FFG900C - Kintex-7 FPGA 326K Cells FCBGA-900 | AMD

The AMD (Xilinx) XC7K325T-2FFG900C is a Kintex-7 FPGA with 326,080 logic cells, 500 user I/Os, and up to 16 GTX serial transceivers, housed in a 900-ball fine-pitch flip-chip BGA (FCBGA-900) package with a commercial 0C to +85C operating range and -2 speed grade. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), block RAM, DSP slices, and programmable interconnect that engineers configure after manufacturing. Within the programmable logic hierarchy, the Kintex-7 family sits between the cost-optimized Artix-7 and the high-performance Virtex-7 families, built on TSMC 28nm HKMG process technology. Key features include 840 DSP48E1 slices for high-throughput math, MMCM and PLL clock management resources reaching 470.37 MHz and beyond, a 12.5 Gb/s-capable GTX transceiver class, and an on-chip XADC (dual 12-bit, 1 MSPS) with an internal +/-1% reference for supply and temperature monitoring. Architecturally, the -2 speed grade fabric operates from a core voltage of 970 mV to 1.03 V, delivering high DSP-per-watt ratios and support for mainstream standards such as PCI Express. The FFG900 package exposes the largest I/O and transceiver bank count of the 325T die, supporting wide DDR3 memory interfaces and high-bandwidth serial backplanes. Typical applications include high-performance DSP engines, wireless baseband and RF front ends, medical imaging, video broadcast processing, and ASIC prototyping. The KC705 evaluation kit accelerates development with pre-verified reference designs. Design consideration: the 1.0 mm-pitch 30x30 mm FCBGA-900 requires an 8-12 layer PCB with sequential blind/buried via fan-out, and precise multi-rail power sequencing per the 7 Series PCB Design Guide. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.

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XC7K325T-2FFG900I - Kintex-7 FPGA 326K Logic Cells | AMD
XC7K325T-2FFG900I

XC7K325T-2FFG900I - Kintex-7 FPGA 326K Logic Cells | AMD

The AMD XC7K325T-2FFG900I is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process, offering 326,080 logic cells, 16,404,480 bits of block RAM, and 500 user I/O pins in a 900-ball FCBGA package. It is designed for applications requiring high processing power, flexibility, and reconfigurability, such as wired and wireless communications, data center acceleration, and aerospace and defense systems. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the hardware to be reprogrammed to perform different logic functions. FPGAs sit within the broader category of programmable logic devices (PLDs), which are a subset of integrated circuits used to implement digital logic. The Kintex-7 family is positioned as the best price/performance/watt balance in the 7-series, bridging the gap between the low-cost Artix-7 and the high-performance Virtex-7 families. Key features of the XC7K325T-2FFG900I include 840 DSP48E1 slices for high-speed digital signal processing, 500 user I/O pins supporting multiple I/O standards, and 16.4 Mb of block RAM. The device supports mainstream standards like PCIe Gen3 and 10 Gigabit Ethernet, making it suitable for high-throughput data paths. The -2 speed grade offers a balanced performance point, while the industrial (I) temperature grade supports operation from -40°C to +100°C, enabling deployment in harsh environments. Architecturally, the Kintex-7 family is built on AMD's (formerly Xilinx) 28nm high-k metal gate (HKMG) process technology. The device integrates configurable logic blocks (CLBs), block RAM, DSP slices, and high-speed transceivers, all interconnected by a programmable routing fabric. This architecture allows designers to implement complex digital systems, from soft-core processors to high-speed serial interfaces, within a single device. Typical applications include software-defined radio (SDR), medical imaging, video processing, and high-performance computing. The device's high DSP ratio and cost-effective packaging make it ideal for applications that require significant parallel processing capability without the cost of a Virtex-class device. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and a well-designed PCB layout to ensure signal integrity at high I/O speeds. Adequate cooling, such as a heatsink or forced airflow, is necessary to keep the junction temperature within the specified range.

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XC7K355T-2FF901I - Kintex-7 FPGA 356K Logic Cells | AMD
XC7K355T-2FF901I

XC7K355T-2FF901I - Kintex-7 FPGA 356K Logic Cells | AMD

The AMD XC7K355T-2FF901I is a high-performance Field Programmable Gate Array (FPGA) from the Kintex-7 family, designed to deliver an optimal balance of logic density, DSP capability, and power efficiency. It features 356,160 logic cells, 26,357,760 block RAM bits, and 300 user I/O pins in a 900-ball FCBGA (FF901) package. This device operates with power supplies of 1.0V, 1.8V, and 3.3V, supporting a wide range of I/O standards. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain programmable logic blocks and interconnects that allow the hardware to be reprogrammed to implement any digital logic function. The Kintex-7 family sits between the cost-optimized Artix-7 and the high-performance Virtex-7 in the Xilinx 7-series hierarchy, offering a balance of price, performance, and power for mid-to-high-range applications. Key features of the XC7K355T-2FF901I include 356,160 logic cells, 26,357,760 bits of block RAM, and 300 user I/O pins. The -2 speed grade indicates a mid-range performance level, while the I suffix denotes an industrial temperature range of -40°C to +100°C. The FF901 package provides 900 balls in a square BGA form factor, enabling high-density routing for complex designs. Technically, the Kintex-7 family is built on a 28nm high-k metal gate (HKMG) process technology, offering significant power and performance improvements over previous generations. The device includes advanced DSP48E1 slices, high-speed transceivers, and integrated memory controllers, making it suitable for a wide range of applications. The 900-ball package supports multiple I/O standards and provides excellent signal integrity for high-speed interfaces. Typical applications for the XC7K355T-2FF901I include telecommunications infrastructure, aerospace and defense systems, high-performance computing, and medical imaging. Its combination of logic density, DSP capability, and power efficiency makes it ideal for signal processing, software-defined radio, and video processing applications. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The 28nm process and high logic density require robust power distribution networks and adequate cooling solutions to ensure reliable operation at industrial temperatures.

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XC7K355T-2FFG901I - Kintex-7 FPGA 356K Logic Cells | AMD
XC7K355T-2FFG901I

XC7K355T-2FFG901I - Kintex-7 FPGA 356K Logic Cells | AMD

The AMD XC7K355T-2FFG901I is a high-performance Field Programmable Gate Array (FPGA) from the Kintex-7 family, offering an optimal balance of price, performance, and power consumption. It features 356,160 logic cells, 300 user I/Os, and 26,357,760 total RAM bits, all in a 900-ball FCBGA package. Operating from a 0.97V to 1.03V supply, this device is designed for a wide range of applications including aerospace, automotive, industrial, and defense sectors. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and reconfigurable interconnects, allowing for rapid prototyping and flexible hardware design. The Kintex-7 family is positioned as a mid-to-high-range solution, providing substantial logic density, advanced DSP capabilities, and high-speed serial connectivity. Key features of the XC7K355T-2FFG901I include 27,825 CLBs, 710 DSP slices, and support for MMCM and PLL clock management. The device operates at a maximum frequency of 1286 MHz and is built on 28nm CMOS technology. The FCBGA-901 package offers excellent thermal and electrical performance, with a compact footprint suitable for space-constrained designs. Technically, the Kintex-7 architecture integrates a flexible 6-input look-up table (LUT) fabric, dedicated block RAM, and high-speed transceivers. The device supports various configuration methods including JTAG, master SPI, and slave SelectMAP. Its advanced power management features enable efficient operation across different performance modes. Typical applications include software-defined radio, high-performance computing, medical imaging, and video processing. The XC7K355T's combination of logic density and DSP capability makes it ideal for signal processing tasks that require parallel computation. When designing with this FPGA, ensure adequate decoupling capacitors on all power rails and follow the recommended power-up sequence to avoid latch-up. The device requires careful thermal management due to its high power dissipation at full utilization.

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XC7K355T-3FFG901E - Kintex-7 FPGA, 356K Logic Cells | AMD
XC7K355T-3FFG901E

XC7K355T-3FFG901E - Kintex-7 FPGA, 356K Logic Cells | AMD

The AMD XC7K355T-3FFG901E is a high-performance Field Programmable Gate Array (FPGA) from the Kintex-7 family, designed to deliver an optimal balance of price, performance, and power consumption. It features 356,160 logic cells, 300 user I/O pins, and 26,357,760 bits of block RAM, all housed in a 900-ball FCBGA (31x31mm) package. The device operates from a 1.0V core supply (0.97V to 1.03V range) and supports high-speed serial transceivers, making it suitable for a wide range of applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be programmed to implement any digital logic function. The Kintex-7 family sits between the low-power Artix-7 and high-performance Virtex-7 families, offering a 2X price-performance improvement over the previous generation. This makes it a popular choice for applications requiring substantial logic density, advanced DSP capabilities, and high-speed serial connectivity without the cost of flagship devices. Key features of the XC7K355T-3FFG901E include 356,160 logic cells, 27,825 CLBs, 300 user I/O pins, and 26,357,760 bits of total RAM. It also integrates 16 GTX transceivers, 8 MMCMs, and 8 PLLs for clock management. The device is built on 28nm technology and supports a core voltage of 1.0V, enabling high performance with manageable power consumption. The FCBGA-901 package provides excellent thermal and electrical characteristics for demanding applications. From a technical perspective, the Kintex-7 architecture includes dedicated DSP48E1 slices for high-speed arithmetic, block RAM for data storage, and configurable I/O banks supporting various voltage standards. The device also features advanced clock management through MMCM and PLL blocks, ensuring precise timing for complex designs. The 28nm process technology balances performance and power, making it suitable for both compute-intensive and power-sensitive applications. Typical applications for the XC7K355T-3FFG901E include 5G wireless infrastructure, high-performance computing, aerospace and defense systems, and medical imaging equipment. Its combination of logic density, DSP capability, and high-speed transceivers makes it ideal for signal processing, data acquisition, and communication systems. The device is also used in prototyping and emulation systems where reconfigurability is essential. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The 1.0V core supply requires low-impedance decoupling capacitors placed close to the device pins. Adequate cooling, such as a heatsink or forced airflow, is necessary to maintain junction temperature within specified limits under full load.

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XC7K410T-1FF900I - Kintex-7 FPGA 406K Logic Cells | AMD
XC7K410T-1FF900I

XC7K410T-1FF900I - Kintex-7 FPGA 406K Logic Cells | AMD

The AMD XC7K410T-1FF900I is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It features 406,720 logic cells, 500 user I/O pins, and 29,306,880 bits of block RAM, all housed in a 900-ball FCBGA package. This device is part of the Kintex-7 family, which balances high-speed serial connectivity, advanced memory interfacing, and cost-effectiveness for a wide range of applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and reconfigurable interconnects, allowing them to implement complex digital logic designs. FPGAs are used in applications requiring high-speed parallel processing, rapid prototyping, and field-upgradable hardware, such as telecommunications, data centers, and aerospace systems. Key features of the XC7K410T-1FF900I include 500 user I/O pins, 29,306,880 bits of block RAM, and support for high-speed transceivers. The device operates at a core voltage of 1V and is available in the -1 speed grade, offering a balanced performance-power trade-off. The 900-ball FCBGA package provides excellent thermal and electrical characteristics, making it suitable for high-density designs. Technically, the Kintex-7 family is built on AMD's 28nm high-k metal gate (HKMG) process, which reduces power consumption while maintaining high performance. The device includes hardened memory controllers, DSP slices, and clock management tiles (CMTs) with MMCM and PLL, enabling efficient implementation of complex algorithms and high-speed interfaces. The XC7K410T-1FF900I supports various I/O standards, including LVCMOS, LVDS, and HSTL, and can interface with DDR3/DDR4 memory. Typical applications include wired and wireless communications, data center acceleration, video and image processing, and scientific instrumentation. The high logic density and I/O count make it ideal for implementing large-scale digital signal processing (DSP) chains, packet processing, and software-defined radio (SDR) systems. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and a well-designed PCB layout to ensure signal integrity at high speeds. AMD provides comprehensive design tools, including Vivado, to facilitate implementation and verification.

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XC7K410T-1FFG676C - Kintex-7 FPGA 406K Logic Cells | AMD
XC7K410T-1FFG676C

XC7K410T-1FFG676C - Kintex-7 FPGA 406K Logic Cells | AMD

The AMD XC7K410T-1FFG676C is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It features 406,720 logic cells, 400 I/O pins, and 29,306,880 bits of block RAM, all housed in a 676-ball FCBGA package. This device is designed for applications requiring high DSP ratios, cost-effective packaging, and support for mainstream standards like PCIe Gen3 and 10 Gigabit Ethernet. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the blocks to be wired together in different configurations. This flexibility makes FPGAs ideal for prototyping, low-to-mid volume production, and applications requiring hardware reconfiguration. The Kintex-7 family sits between the Artix-7 (lowest cost) and Virtex-7 (highest performance) in AMD's 7-series portfolio, offering the best price/performance/watt at 28nm. Key features of the XC7K410T-1FFG676C include 1,540 DSP48E1 slices for high-speed digital signal processing, 29.3 Mb of block RAM, and support for PCIe Gen3 x8 and 10 Gigabit Ethernet. The device operates from a 1.0V core voltage and supports a wide range of I/O standards including LVCMOS, LVDS, and HSTL. The -1 speed grade provides a balanced performance point suitable for many applications. The architecture integrates configurable logic blocks (CLBs), block RAM, DSP slices, and high-speed transceivers. The 676-ball FCBGA package provides excellent thermal and electrical performance, with the exposed pad aiding heat dissipation. The device supports partial reconfiguration, allowing dynamic updates to specific logic regions without disrupting the entire design. Typical applications include wired communications, broadcast, aerospace and defense, and high-performance computing. The high DSP ratio and cost-effective packaging make it particularly well-suited for wireless MIMO base stations, medical imaging, and video processing systems. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The 1.0V core supply requires a robust power delivery network with multiple decoupling capacitors to maintain signal integrity at high switching frequencies.

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XC7K410T-1FFG900I - Kintex-7 FPGA 406K Logic Cells | AMD
XC7K410T-1FFG900I

XC7K410T-1FFG900I - Kintex-7 FPGA 406K Logic Cells | AMD

The AMD XC7K410T-1FFG900I is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It delivers 406,720 logic cells, 500 user I/Os, and 29,306,880 bits of block RAM, all housed in a 900-ball FCBGA (31x31mm) package. Operating from a 1V core supply, this device targets demanding applications requiring high logic density, DSP capability, and serial connectivity. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the designer after manufacturing, allowing custom digital logic implementations. FPGAs sit within the broader hierarchy of programmable logic devices, offering reconfigurability that bridges the gap between fixed-function ASICs and software-programmable processors. The Kintex-7 family is positioned as a mid-range, high-performance FPGA family within the AMD/Xilinx 7 series, balancing logic capacity, transceiver speed, and power efficiency. Key features of the XC7K410T-1FFG900I include 500 user I/Os supporting various I/O standards, 29,306,880 bits of block RAM for on-chip data storage, and 1,540 DSP slices for high-throughput signal processing. The device also integrates 16 GTX transceivers capable of up to 12.5 Gb/s, enabling high-speed serial communication. The -1 speed grade offers a balanced performance point, while the industrial (I) temperature grade supports operation from -40°C to +100°C. Architecturally, the Kintex-7 FPGA is built on a 28nm high-k metal gate (HKMG) process, providing a favorable performance-per-watt ratio. The device includes hardened memory controllers, PCIe blocks, and mixed-mode clock managers (MMCMs) and PLLs for robust clock generation. This integration reduces external component count and simplifies board design. Typical applications include high-performance computing, wired and wireless communications, aerospace and defense systems, and medical imaging. The combination of high logic density, DSP resources, and high-speed transceivers makes it suitable for software-defined radio, radar processing, and video processing systems. When designing with this device, careful attention to power supply decoupling and thermal management is essential. The 1V core supply requires a clean, low-impedance power plane, and the FCBGA package's thermal pad should be connected to a solid ground plane with adequate vias for heat dissipation.

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XC7K410T-2FFG900C - Kintex-7 FPGA 406K Logic Cells | AMD
XC7K410T-2FFG900C

XC7K410T-2FFG900C - Kintex-7 FPGA 406K Logic Cells | AMD

The AMD XC7K410T-2FFG900C is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It delivers 406,720 logic cells, 500 user I/O pins, and 29,306,880 bits of block RAM, making it a versatile choice for demanding signal processing and connectivity applications. The device is housed in a 900-ball FCBGA package and operates from a 1V core supply. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain programmable logic blocks, configurable interconnects, and embedded memory that allow the hardware to be reprogrammed to implement arbitrary digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which range from simple CPLDs to massive data center accelerators. The Kintex-7 family specifically targets the balance of price, performance, and power at 28nm, offering high DSP ratios and support for mainstream standards like PCIe Gen3 and 10 Gigabit Ethernet. Key features of the XC7K410T-2FFG900C include 1,540 DSP slices for high-throughput digital signal processing, 500 user I/O pins supporting multiple I/O standards, and 29,306,880 bits of block RAM. The device also integrates hardened memory controllers, high-speed serial transceivers, and clock management tiles (MMCM and PLL) for robust timing. The -2 speed grade provides a balance between performance and power consumption, with a maximum clock frequency of 1286 MHz for internal logic. Architecturally, the Kintex-7 family uses a unified 7 series architecture with configurable logic blocks (CLBs), block RAM, and DSP48E1 slices. The 28nm high-k metal gate (HKMG) process enables high logic density while maintaining reasonable power dissipation. The device supports partial reconfiguration, allowing dynamic updates to specific logic regions without halting the entire system. Typical applications include high-performance computing, aerospace and defense signal processing, medical imaging, and wired/wireless communications infrastructure. The 900-ball FCBGA package provides excellent thermal and electrical characteristics for high-speed designs. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple voltage rails (VCCINT, VCCAUX, VCCO) with proper sequencing, and the FCBGA package benefits from a thermal solution for high-utilization designs.

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XC7K410T-2FFG900I - Kintex-7 FPGA 406K Logic Cells | AMD
XC7K410T-2FFG900I

XC7K410T-2FFG900I - Kintex-7 FPGA 406K Logic Cells | AMD

The AMD XC7K410T-2FFG900I is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on the 28nm HPL (High-Performance, Low-Power) HKMG (High-κ Metal Gate) process. It offers 406,720 logic cells, 500 user I/Os, and 29,306,880 bits of block RAM, all housed in a 900-ball FCBGA (FFG900) package. This device is designed for applications requiring high DSP ratios, cost-effective packaging, and support for mainstream standards like PCIe Gen3 and 10 Gigabit Ethernet. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence 'field-programmable'. It consists of an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement complex digital functions. FPGAs are a subset of programmable logic devices (PLDs) and are widely used in prototyping, signal processing, and high-speed interfacing where ASIC development is impractical. Key features of the XC7K410T-2FFG900I include 500 user I/Os, 29,306,880 bits of block RAM, and 1,540 DSP slices (DSP48E1). It supports multiple I/O standards including LVCMOS, LVDS, and HSTL, and includes advanced clock management through MMCM (Mixed-Mode Clock Manager) and PLL (Phase-Locked Loop) blocks. The device also supports partial reconfiguration, enabling dynamic updates to logic functions without powering down. From a technical perspective, the Kintex-7 family balances performance and power efficiency, making it suitable for cost-sensitive, high-volume applications. The -2 speed grade indicates a mid-range performance level, with the 'I' suffix denoting an industrial temperature range (-40°C to +100°C). The FFG900 package provides a 900-ball footprint with a 31x31 mm body, offering excellent thermal and electrical characteristics for high-density designs. Typical applications include software-defined radio, medical imaging, aerospace and defense systems, and high-performance computing. The device's high DSP ratio and support for 10 Gigabit Ethernet make it ideal for communications infrastructure and data acquisition systems. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and a robust power distribution network. Adequate PCB layout with proper grounding and bypass capacitors is essential for reliable operation at high speeds.

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XC7K420T-1FFG1156C - Kintex-7 FPGA 416K Cells | AMD
XC7K420T-1FFG1156C

XC7K420T-1FFG1156C - Kintex-7 FPGA 416K Cells | AMD

The AMD XC7K420T-1FFG1156C is a high-performance Field Programmable Gate Array (FPGA) from the Kintex-7 family, fabricated on a 28nm process. It features 416,960 logic cells, 32,575 CLBs, and 30,781,440 bits of block RAM, providing substantial resources for complex digital designs. The device is packaged in a 1156-ball FCBGA (FFG1156) with 400 user I/O pins, supporting a wide range of I/O standards. It operates over a commercial temperature range of 0°C to 85°C and is available in a -1 speed grade, offering a balance of performance and power efficiency. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be programmed to implement any digital logic function. FPGAs are part of the broader category of programmable logic devices (PLDs), which also includes CPLDs. They are widely used in applications requiring flexibility, rapid prototyping, and parallel processing, such as telecommunications, data centers, and aerospace. Key features of the XC7K420T-1FFG1156C include 400 user I/O pins, 30.7 Mb of block RAM, and support for high-speed serial transceivers (GTX) up to 12.5 Gb/s. The Kintex-7 family is optimized for high performance with lower power consumption compared to previous generations, making it suitable for bandwidth-intensive applications. The device also supports partial reconfiguration, allowing dynamic updates to logic functions without powering down. Technically, the Kintex-7 architecture integrates DSP48E1 slices for high-speed arithmetic, clock management tiles (CMT) for precise clock generation, and advanced I/O blocks supporting various voltage standards. The 28nm high-k metal gate (HKMG) process technology enables high logic density and low static power. The -1 speed grade provides a maximum clock frequency of approximately 1098 MHz, as noted in some datasheets, though actual performance depends on design. Typical applications include wired and wireless communications, broadcast video, aerospace and defense, and high-performance computing. The XC7K420T-1FFG1156C is particularly suited for signal processing, packet processing, and video/image processing where high throughput and low latency are critical. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply voltages (VCCINT, VCCAUX, VCCO) and a well-designed power distribution network to ensure reliable operation. Adequate cooling, such as a heatsink or forced airflow, is necessary to keep junction temperature within limits.

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XC7K420T-2FFG1156I - Kintex-7 FPGA 416K Cells | AMD
XC7K420T-2FFG1156I

XC7K420T-2FFG1156I - Kintex-7 FPGA 416K Cells | AMD

The AMD Xilinx XC7K420T-2FFG1156I is a high-performance Field Programmable Gate Array (FPGA) from the Kintex-7 family, built on advanced 28nm HK-HPC process technology. It delivers 416,960 logic cells and 400 user I/Os in a 1156-pin FC-BGA (FFG1156) package, operating from a nominal 1.0V core supply. This device is designed for high-bandwidth, high-capacity applications requiring significant logic density and DSP throughput. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, configurable I/O, and routing resources that can be programmed to implement any digital logic function. The Kintex-7 family sits between the cost-optimized Artix-7 and the high-end Virtex-7 in the Xilinx 7-series hierarchy, offering an optimal balance of performance, power, and price for mid-range to high-end applications. Key features of the XC7K420T-2FFG1156I include 32,575 Configurable Logic Blocks (CLBs), 30,781,440 bits of block RAM, and 400 user I/O pins. The -2 speed grade provides fast performance, while the I suffix indicates an industrial temperature range of -40°C to +100°C (TJ). The device supports a wide range of I/O standards including LVCMOS, LVDS, and HSTL, and includes hardened memory controllers, DSP48E1 slices, and high-speed serial transceivers. Architecturally, the Kintex-7 family integrates a 6-input look-up table (LUT) fabric, dedicated carry logic, and distributed RAM. The device includes 1,680 DSP48E1 slices for high-throughput signal processing, and up to 16 high-speed GTX transceivers (depending on package variant) supporting data rates up to 12.5 Gb/s. The 28nm process technology enables high logic density with lower power consumption compared to previous generations. Typical applications include high-performance computing, aerospace and defense signal processing, medical imaging, wired and wireless communications, and video processing. The 400 I/Os and large block RAM make it suitable for memory-intensive designs, while the DSP resources handle complex algorithms. The industrial temperature range extends usability to harsh environments. When designing with this device, careful attention to power supply decoupling and thermal management is essential. The 1.0V core supply requires a robust power delivery network, and the FC-BGA package needs adequate PCB layout for signal integrity at high speeds.

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XC7K420T-2FFG901I - Kintex-7 FPGA, 416K Logic Cells | AMD
XC7K420T-2FFG901I

XC7K420T-2FFG901I - Kintex-7 FPGA, 416K Logic Cells | AMD

The AMD XC7K420T-2FFG901I is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) from the 28nm Kintex-7 family, offering 416,960 logic cells, 380 user I/Os, and 28Mb of block RAM in a 900-ball FCBGA package. It is designed for applications requiring a balance of high logic density, DSP throughput, and serial transceiver performance. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are semiconductor components that allow hardware designers to implement custom digital circuits without the high non-recurring engineering costs of ASICs. Within this hierarchy, the Kintex-7 family is positioned as AMD's mid-range, price-performance optimized FPGA line, sitting between the low-power Artix-7 and the high-performance Virtex-7 families. Key features of the XC7K420T-2FFG901I include 416,960 logic cells, 380 user I/Os, 30,744,140 bits of block RAM, and 1,680 DSP slices. The device operates from a 1V core supply and is built on a 28nm high-k metal gate (HKMG) process technology. The -2 speed grade provides a balanced performance point, and the I-grade temperature range supports operation from -40°C to +100°C (Tj). The Kintex-7 architecture integrates 16 high-speed serial transceivers (GTX) capable of up to 12.5 Gb/s, along with hardened memory controllers, PCIe blocks, and mixed-mode clock managers (MMCMs) and PLLs. This integration enables the device to serve as a complete system-on-chip solution for high-bandwidth data path applications. Typical applications include high-performance computing, wired and wireless communications, broadcast video, and aerospace and defense systems. The device's combination of logic density, DSP capability, and transceiver speed makes it suitable for software-defined radio, radar signal processing, and high-speed data acquisition. When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The 900-ball FCBGA package requires a robust PCB layout with multiple ground and power planes, and the core voltage must be regulated to 1.0V ±3% to ensure reliable operation.

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XC7K420T-3FFG1156E - Kintex-7 FPGA 416K Logic Cells | AMD
XC7K420T-3FFG1156E

XC7K420T-3FFG1156E - Kintex-7 FPGA 416K Logic Cells | AMD

The AMD XC7K420T-3FFG1156E is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It features 416,960 logic cells, 32,575 Configurable Logic Blocks (CLBs), and 400 user I/O pins. The device is housed in a 1156-ball FCBGA package and operates from a 1V core supply. This FPGA is designed for high-bandwidth, high-capacity applications requiring significant logic density and DSP capabilities. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs contain a matrix of programmable logic blocks, interconnects, and I/O blocks, allowing them to implement complex digital logic functions. They are a key component in the broader category of programmable logic devices, which also includes CPLDs and SoC FPGAs. FPGAs offer flexibility and parallel processing capabilities that are essential in modern electronic systems. Key features of the XC7K420T-3FFG1156E include 30,781,440 bits of block RAM, providing substantial on-chip storage for data buffering and processing. The device supports a wide range of I/O standards and includes high-speed serial transceivers for chip-to-chip and backplane communication. The -3 speed grade indicates the fastest performance tier available for this device, enabling higher clock frequencies and data rates. The Kintex-7 family is built on AMD's 28nm high-performance, low-power (HPL) process, balancing performance with power efficiency. The architecture includes dedicated DSP48E1 slices for high-speed arithmetic operations, and advanced clock management tiles (CMTs) for precise clock generation and distribution. This makes the device suitable for demanding signal processing and data-intensive tasks. Typical applications include high-performance computing, aerospace and defense systems, medical imaging, and wired communications infrastructure. The large logic capacity and high-speed transceivers make it ideal for implementing complex algorithms and high-throughput data paths. The 400 I/O pins provide ample connectivity for external memory interfaces and peripheral devices. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply voltages, and proper sequencing is essential for reliable operation. The FCBGA package requires a multi-layer PCB with controlled impedance traces for high-speed signals.

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XC7K480T-1FFG901I - Kintex-7 FPGA 477K Logic Cells | AMD
XC7K480T-1FFG901I

XC7K480T-1FFG901I - Kintex-7 FPGA 477K Logic Cells | AMD

The AMD XC7K480T-1FFG901I is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) from the Kintex-7 family, offering 477,760 logic cells and 35,205,120 block RAM bits in a 900-ball FCBGA package. It provides 380 user I/O pins and operates over an industrial temperature range of -40°C to +100°C. This device is designed for high-bandwidth, high-capacity applications requiring significant logic density and DSP resources. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs are part of the programmable logic device family, sitting between ASICs and CPLDs in complexity. They contain a matrix of configurable logic blocks (CLBs) connected via programmable interconnects, allowing for highly parallel, custom digital logic implementations. FPGAs are used in a wide range of applications from telecommunications and aerospace to automotive and data centers. The XC7K480T-1FFG901I features the Kintex-7 architecture, which balances performance, power, and cost. It includes 1,920 DSP slices for high-speed digital signal processing, 380 user I/Os supporting various I/O standards, and 35.2 Mb of block RAM. The -1 speed grade offers a balanced performance point, while the industrial temperature grade (-I) ensures reliable operation in harsh environments. The device supports configuration through multiple methods including JTAG, master/slave SPI, and SelectMAP. This FPGA is built on a 28nm process technology, providing a good balance of power efficiency and logic density. The 900-ball FCBGA package (FFG901) offers excellent thermal and electrical characteristics for high-performance designs. With 477,760 logic cells, it can implement complex systems-on-chip, including soft-core processors, high-speed serial transceivers, and sophisticated DSP algorithms. Typical applications include high-performance computing, wired and wireless communications, aerospace and defense systems, medical imaging, and broadcast video processing. The device's high logic density and DSP capabilities make it suitable for implementing complex algorithms in hardware. When designing with this FPGA, careful attention must be paid to power supply decoupling, clock management, and thermal management to ensure reliable operation at full capacity.

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XC7K480T-2FFG1156I - Kintex-7 FPGA 477K Logic Cells | AMD
XC7K480T-2FFG1156I

XC7K480T-2FFG1156I - Kintex-7 FPGA 477K Logic Cells | AMD

The AMD XC7K480T-2FFG1156I is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) from the 28nm 7-series family, offering 477,760 logic cells, 400 user I/Os, and 35,205,120 block RAM bits in a 1156-ball FCBGA package. It operates from a 1.0V core supply (0.97V to 1.03V) and supports a maximum clock frequency of 1286 MHz, making it suitable for demanding DSP, communications, and data processing applications. A Field Programmable Gate Array (FPGA) is an integrated circuit whose logic fabric can be reconfigured after manufacturing to implement arbitrary digital logic functions. FPGAs sit between ASICs (fixed-function, high-volume) and microprocessors (software-programmable) in the design spectrum, offering hardware-level parallelism and determinism with field reconfigurability. The Kintex-7 family is optimized for best price-performance, delivering a 2X improvement over the previous generation, enabling a new class of FPGAs for cost-sensitive, high-bandwidth systems. Key features include 400 user I/Os supporting multiple I/O standards, 35,205,120 bits of block RAM for on-chip data storage, and 477,760 logic cells for complex digital designs. The device integrates MMCM (Mixed-Mode Clock Manager) and PLL (Phase-Locked Loop) blocks for robust clock generation and distribution. The 1156-ball FCBGA package provides excellent thermal and electrical performance, with a low-cost, very small form-factor footprint for space-constrained PCBs. Built on 28nm high-k metal gate (HKMG) process technology, the Kintex-7 family balances performance, power, and cost. The -2 speed grade offers a strong trade-off between maximum clock frequency and power consumption. The device supports partial reconfiguration, enabling dynamic updates to logic functions without full device reprogramming, which is valuable in software-defined radio and adaptive computing systems. Typical applications include software-defined radio (SDR), high-performance digital signal processing, wired and wireless communications infrastructure, and data acquisition systems. The 400 I/Os and high logic density make it ideal for protocol bridging, packet processing, and real-time signal conditioning. The 1.0V core supply and 28nm process enable efficient operation in power-sensitive rack-mounted equipment. When designing with this device, ensure adequate decoupling on all power rails (VCCINT, VCCAUX, VCCO) and follow AMD's power-on sequencing requirements. The 1156-ball FCBGA requires careful PCB layout with controlled impedance traces for high-speed transceivers and proper thermal management via a heatsink or forced airflow for high-utilization designs.

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