XC7K325T-2FFG900C - Kintex-7 FPGA 326K Cells FCBGA-900 | AMD
Teilenummer: XC7K325T-2FFG900C ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1890 | $1.890,00 |
| 10 | $1802.5 | $18.025,00 |
| 100 | $1725 | $172.500,00 |
| 500 | $1655 | $827.500,00 |
| 1.000 | $1590 | $1.590.000,00 |
XC7K325T-2FFG900C Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), block RAM, DSP slices, and programmable interconnect that engineers configure after manufacturing. Within the programmable logic hierarchy, the Kintex-7 family sits between the cost-optimized Artix-7 and the high-performance Virtex-7 families, built on TSMC 28nm HKMG process technology.
Key features include 840 DSP48E1 slices for high-throughput math, MMCM and PLL clock management resources reaching 470.37 MHz and beyond, a 12.5 Gb/s-capable GTX transceiver class, and an on-chip XADC (dual 12-bit, 1 MSPS) with an internal +/-1% reference for supply and temperature monitoring.
Architecturally, the -2 speed grade fabric operates from a core voltage of 970 mV to 1.03 V, delivering high DSP-per-watt ratios and support for mainstream standards such as PCI Express. The FFG900 package exposes the largest I/O and transceiver bank count of the 325T die, supporting wide DDR3 memory interfaces and high-bandwidth serial backplanes.
Typical applications include high-performance DSP engines, wireless baseband and RF front ends, medical imaging, video broadcast processing, and ASIC prototyping. The KC705 evaluation kit accelerates development with pre-verified reference designs.
Design consideration: the 1.0 mm-pitch 30x30 mm FCBGA-900 requires an 8-12 layer PCB with sequential blind/buried via fan-out, and precise multi-rail power sequencing per the 7 Series PCB Design Guide.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für XC7K325T-2FFG900C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XC7K325T-2FFG900C (gleiche Bauform und Footprint) – abweichend in Package, Block RAM, Core Voltage (VCCINT), DSP Slices, Logic Cells.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XC7K325T-2FFG900I
✅ Drop-In✓ Auf Lager
$65 / Stück
Datenblatt ansehen →XC7K325T-1FFG900C
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7K325T-1FFG900I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7K325T-2LFFG900C
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7K325T-2LFFG900I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7K325T-2FFG900C Grenzwerte & elektrische Eigenschaften
| Family | Kintex-7 |
| Number of Logic Cells | 326080 |
| Number of CLB Flip-Flops | 407600 |
| Maximum Distributed RAM | 16404480 bits |
| Number of DSP48E1 Slices | 840 |
| Total Memory (Block RAM) | 16024640 bits |
| Number of GTX Transceivers | 16 |
| Maximum User I/O | 500 |
| Speed Grade | -2 |
| Core Voltage (VCCINT) | 970 mV to 1.03 V |
| Maximum Fabric Frequency | 470.37 MHz |
| Betriebstemperatur | 0C to +85C (commercial) |
| Gehäuse | 900-BBGA, FCBGA (FFG900), 30x30 mm, 1.0 mm pitch |
| Process Technology | 28 nm HKMG |
| Clock Management | MMCM + PLL |
| XADC | Dual 12-bit 1 MSPS with +/-1% internal reference |
| Montageart | Surface Mount |
XC7K325T-2FFG900C 900-bbga, fcbga (ffg900), 30x30 mm, 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für XC7K325T-2FFG900C (900-bbga, fcbga (ffg900), 30x30 mm, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XC7K325T-2FFG900C.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XC7K325T-2FFG900C ist geeignet für 6 Anwendungs: High-Performance DSP Processing, Wireless Baseband and Radio, Medical Imaging Systems, Video Broadcast and Processing, ASIC Prototyping and Emulation, High-Speed Data Acquisition and Test.
High-Performance DSP Processing
The XC7K325T-2FFG900C is a strong fit for high-throughput DSP because it provides 840 DSP48E1 slices, each capable of a 25x18 multiplier-accumulate, sustaining aggregate processing rates in the hundreds of GMACs at the -2 speed grade. Radar pulse compression, software-defined radio filtering, and MIMO beamforming maps naturally onto the DSP column architecture with cascaded DSP48 chains. Combined with 16,024,640 bits of block RAM, FIR filter banks and FFT engines can buffer data on-chip without external memory latency. Placing the DSP pipeline near GTX transceivers keeps JESD204B ADC data paths short, and the 470.37 MHz-class fabric timing enables single-channel rate sampling well above 500 MSPS after decimation.
Empfohlen
Wireless Baseband and Radio
For wireless infrastructure, the XC7K325T-2FFG900C delivers the best price/performance/watt ratio of the 7 Series at 28nm, a key requirement AMD cites for the Kintex-7 family. The 16 GTX transceivers support CPRI/OBSAI fronthaul links at up to 9.8 Gb/s, while the 840 DSP48E1 slices implement LTE-A and 5G layer-1 functions such as channel coding, OFDM modulation, and digital up/down conversion. MMCM and PLL clocking resources clean and distribute the multiple reference clocks a radio card needs. In a typical macro baseband card, the FFG900 package supplies the 500 I/O needed to attach wide DDR3 buffers and RFIC control buses without external fanout logic.
Empfohlen
Medical Imaging Systems
Ultrasound, CT, and MRI front ends benefit from the XC7K325T-2FFG900C because beamforming demands hundreds of parallel delay-and-sum channels, which map efficiently onto the 840 DSP48E1 slices and abundant distributed RAM of the 325T die. The on-chip XADC with its +/-1% internal reference monitors board supply rails and temperature for system-level safety compliance without external monitoring ICs. The 500 user I/Os of the FFG900 package interface directly to multi-channel AFE chips over LVDS, sustaining the sustained sample throughput that image reconstruction pipelines require, while GTX transceivers move reconstructed frames to the display subsystem over serial links at multi-gigabit rates.
Empfohlen
Video Broadcast and Processing
The XC7K325T-2FFG900C suits 4K broadcast equipment because its block RAM (16,024,640 bits) and DSP resources support multi-stream H.264/HEVC motion estimation and format conversion at 60 fps. The 500 I/O count handles dual 4-lane SDI or HDMI receivers plus DDR3 frame buffers through wide memory controllers. GTX transceivers carry SMPTE 2022 / IP-video streams over 10G Ethernet MAC implementations, an increasingly common broadcast transport. The -2 speed grade provides timing headroom for 300 MHz pixel pipelines in the FFG900 package, and the KC705 development kit offers a proven reference platform including video IP and pre-verified memory interfaces to shorten design cycles for broadcast OEMs.
Empfohlen
ASIC Prototyping and Emulation
With 326,080 logic cells and the largest 500-I/O FFG900 footprint of the 325T die, this device is widely used to prototype ASIC and SoC RTL at 10-50 MHz before tape-out. The -2 speed grade maximizes emulation clock rates, cutting verification wall-clock time proportionally, while 16,024,640 block RAM bits model on-chip memories at scale. The GTX transceivers link multiple prototype FPGAs into multi-chip partitions over multi-gigabit channels for larger designs. Multi-voltage banks on the FFG900 package let the board mix 1.8 V, 2.5 V, and 3.3 V signaling to legacy interface models, and the commercial 0C to +85C grade is sufficient for lab and datacenter emulation environments.
Empfohlen
High-Speed Data Acquisition and Test
Test-and-measurement and scientific instruments leverage the XC7K325T-2FFG900C's 16 GTX transceivers to aggregate multi-GSPS ADC data over serial links in real time, while the 840 DSP48E1 slices run on-the-fly FFT, windowing, and decimation. The FFG900 package's 500 I/O support wide parallel LVDS ADC buses at up to 1.2 Gb/s per pair for legacy converter families. The dual 12-bit XADC enables in-system monitoring of rail droop during peak acquisition bursts, protecting measurement integrity. Because the commercial 0C to +85C grade covers typical instrument environments and DigiKey reports same-day shipping, this part is also convenient for prototype instrument builds with short development schedules.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC7K325T-2FFG900C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC7K325T-2FFG900I | XC7K325T-1FFG900C | XC7K325T-1FFG900I | XC7K325T-2LFFG900C | XC7K325T-2LFFG900I |
|---|---|---|---|---|---|---|
| Package | FCBGA-900 (FFG900), 30x30 mm | FCBGA-900 (FFG900) - same | FCBGA-900 (FFG900) - same | FCBGA-900 (FFG900) - same | FCBGA-900 (FFG900) - same | FCBGA-900 (FFG900) - same |
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Logic Cells | 326080 | 326080 | 326080 | 326080 | 326080 | 326080 |
| Speed Grade | -2 | -2 | -1 (slower) | -1 (slower) | -2L (low power, slightly lower fmax) | -2L (low power, slightly lower fmax) |
| Operating Temperature | 0C to +85C | -40C to +100C | 0C to +85C | -40C to +100C | 0C to +85C | -40C to +100C |
| Max User I/O | 500 | 500 | 500 | 500 | 500 | 500 |
| DSP48E1 Slices | 840 | 840 | 840 | 840 | 840 | 840 |
| GTX Transceivers | 16 | 16 | 16 | 16 | 16 | 16 |
| Core Voltage (VCCINT) | 970 mV to 1.03 V | 970 mV to 1.03 V | 970 mV to 1.03 V | 970 mV to 1.03 V | Lower nominal (low-power grade) | Lower nominal (low-power grade) |
Wichtigste Unterscheidungsmerkmale
- Fastest -2 speed grade in commercial temperature range (vs. XC7K325T-1FFG900C)
- Lowest static power option in the same footprint (vs. XC7K325T-2LFFG900C)
- Lowest unit cost commercial-grade option (vs. XC7K325T-2FFG900I)
Designhinweise
The FFG900 package is a 30x30 mm, 1.0 mm-pitch FCBGA with approximately 900 balls. Plan an 8-12 layer PCB with at least two dedicated power planes and a fan-out region supporting 0.15 mm via-in-pad or dogbone escapes. Follow the Xilinx 7 Series PCB Design Guide (UG483) for via stackup and escape patterns; blind/buried vias are commonly required to route 500+ signals out of four quadrants. Order the ballout CSV from the AMD Kintex-7 package pinout files and import it into your CAD tool rather than hand-entering balls.
The device requires multiple rails (VCCINT 0.97-1.03 V at the -2 grade, plus VCCAUX, VCCO banks, VCCBRAM, and MGTAVCC/MGTAVTT for the GTX channels). Follow the Xilinx-recommended power sequencing (core before/with I/O per UG483) and select regulators with fast transient response, since load steps from clock gating can exceed several amps per rail in an instant. Budget total power using the Xilinx Power Estimator with your actual utilization; a fully loaded 325T at -2 with active transceivers typically demands multi-amp core delivery and a heatsink above roughly 5 W dissipation.
For GTX transceiver channels, maintain 100-ohm differential routing with matched intra-pair skew below 5 mil, and route AC-coupling caps symmetrically per UG476. Keep GTX reference clock traces short and away from switching I/O banks. For the memory controller, use the Xilinx MIG tool to generate DDR3 routing rules (length matching within 10-25 mil per byte lane depending on speed). Simulate the longest LVDS bank routes if they exceed 15 inches; the 1.2 Gb/s-class LVDS modes leave limited margin for stubs and impedance discontinuities.
Common mistakes: (1) generating the bitstream for the wrong speed grade - a -1 bitstream loads on -2 silicon but not vice versa; (2) ignoring bank VCCO grouping, which forces respins when mixed-voltage devices share a bank; (3) omitting the XADC decoupling and reference circuit, degrading supply monitoring accuracy; (4) leaving configuration mode pins (M[2:0]) floating instead of strapped to the intended boot source. Verify all pin strapping against UG470 configuration guidance before tape-out.
Compliance-Informationen
Compliance attributes not stated in the provided web data; verify on the AMD/Xilinx official product page and package environmental reports before export or automotive use.
