XC7K410T-2FFG900I - Kintex-7 FPGA 406K Logic Cells | AMD
Teilenummer: XC7K410T-2FFG900I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1261.04 | $1.261,04 |
| 10 | $1180 | $11.800,00 |
| 100 | $1050 | $105.000,00 |
| 500 | $980 | $490.000,00 |
| 1.000 | $920 | $920.000,00 |
XC7K410T-2FFG900I Übersicht
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence 'field-programmable'. It consists of an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement complex digital functions. FPGAs are a subset of programmable logic devices (PLDs) and are widely used in prototyping, signal processing, and high-speed interfacing where ASIC development is impractical.
Key features of the XC7K410T-2FFG900I include 500 user I/Os, 29,306,880 bits of block RAM, and 1,540 DSP slices (DSP48E1). It supports multiple I/O standards including LVCMOS, LVDS, and HSTL, and includes advanced clock management through MMCM (Mixed-Mode Clock Manager) and PLL (Phase-Locked Loop) blocks. The device also supports partial reconfiguration, enabling dynamic updates to logic functions without powering down.
From a technical perspective, the Kintex-7 family balances performance and power efficiency, making it suitable for cost-sensitive, high-volume applications. The -2 speed grade indicates a mid-range performance level, with the 'I' suffix denoting an industrial temperature range (-40°C to +100°C). The FFG900 package provides a 900-ball footprint with a 31x31 mm body, offering excellent thermal and electrical characteristics for high-density designs.
Typical applications include software-defined radio, medical imaging, aerospace and defense systems, and high-performance computing. The device's high DSP ratio and support for 10 Gigabit Ethernet make it ideal for communications infrastructure and data acquisition systems.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and a robust power distribution network. Adequate PCB layout with proper grounding and bypass capacitors is essential for reliable operation at high speeds.
Drop-in-Alternativen für XC7K410T-2FFG900I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XC7K410T-2FFG900I (gleiche Bauform und Footprint) – abweichend in Block RAM, DSP Slices, Logic Cells, Package, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XC7K410T-2FFG900C
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$999 / Stück
Datenblatt ansehen →XC7K410T-1FFG900I
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$895 / Stück
Datenblatt ansehen →XC7K410T-3FFG900I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7K325T-2FFG900I
✅ Drop-In✓ Auf Lager
$65 / Stück
Datenblatt ansehen →XC7K355T-2FFG900I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7K410T-2FFG900I Grenzwerte & elektrische Eigenschaften
| Logic Cells | 406,720 |
| Block RAM | 29,306,880 bits |
| DSP Slices | 1,540 |
| User I/O Count | 500 |
| Gehäuse | 900-BBGA, FCBGA (FFG900) |
| Speed Grade | -2 |
| Temperature Range | -40°C to +100°C (industrial) |
| Process Technology | 28nm HPL HKMG |
| Configuration Memory | SRAM-based |
| I/O Standards Supported | LVCMOS, LVDS, HSTL, SSTL, etc. |
| Clock Management | MMCM and PLL |
| Transceivers | 32 (GTX) up to 12.5 Gbps |
| PCIe Support | Gen3 x8 |
| RoHS-Status | Compliant |
| Montageart | Surface Mount |
XC7K410T-2FFG900I Pin-Konfiguration
| Pin A1 | IO_L1P_T0_100 — User I/O bank 100, differential pair P |
| Pin A2 | IO_L1N_T0_100 — User I/O bank 100, differential pair N |
| Pin B1 | IO_L2P_T0_100 — User I/O bank 100, differential pair P |
| Pin B2 | IO_L2N_T0_100 — User I/O bank 100, differential pair N |
| Pin C1 | VCCINT — Internal core voltage supply (1.0V) |
| Pin C2 | GND — Ground |
| Pin D1 | VCCAUX — Auxiliary voltage supply (1.8V) |
| Pin D2 | VCCO_100 — I/O bank 100 supply voltage |
| Pin E1 | IO_L3P_T0_100 — User I/O bank 100, differential pair P |
| Pin E2 | IO_L3N_T0_100 — User I/O bank 100, differential pair N |
| Pin F1 | IO_L4P_T0_100 — User I/O bank 100, differential pair P |
| Pin F2 | IO_L4N_T0_100 — User I/O bank 100, differential pair N |
Typische Anwendungen
XC7K410T-2FFG900I ist geeignet für 6 Anwendungs: Software-Defined Radio, Medical Imaging, Aerospace and Defense, High-Performance Computing, Wired Communications, Test and Measurement.
Software-Defined Radio
The XC7K410T-2FFG900I is ideal for software-defined radio (SDR) systems due to its high DSP slice count (1,540) and support for high-speed transceivers (up to 12.5 Gbps). These resources enable efficient implementation of digital down/up converters, filters, and modulation/demodulation algorithms. The 500 user I/Os allow flexible interfacing with high-speed ADCs and DACs, while the industrial temperature range ensures reliable operation in harsh environments. Designers can leverage the FPGA's partial reconfiguration to update waveforms on the fly, making it a versatile platform for military and commercial communications.
Empfohlen
Medical Imaging
In medical imaging systems such as ultrasound and CT scanners, the XC7K410T-2FFG900I provides the computational horsepower needed for real-time image processing. Its 406,720 logic cells and 1,540 DSP slices can handle complex algorithms like beamforming, filtering, and image enhancement. The high-speed transceivers enable fast data transfer from sensors, while the 500 I/Os interface with multiple ADC channels. The industrial temperature range ensures reliability in clinical environments. The FPGA's reconfigurability allows for algorithm updates without hardware changes, extending the life of medical equipment.
Empfohlen
Aerospace and Defense
The XC7K410T-2FFG900I is well-suited for aerospace and defense applications such as radar, electronic warfare, and secure communications. Its high logic density and DSP capabilities enable complex signal processing, while the industrial temperature range (-40°C to +100°C) meets military environmental requirements. The FPGA supports partial reconfiguration, allowing in-field updates to encryption algorithms or signal processing chains. With 500 I/Os and high-speed transceivers, it can interface with a wide range of sensors and communication links. AMD's long-term supply commitment ensures availability for defense programs.
Empfohlen
High-Performance Computing
In high-performance computing (HPC) applications, the XC7K410T-2FFG900I accelerates data-intensive workloads such as financial modeling, scientific simulations, and big data analytics. Its 406,720 logic cells and 1,540 DSP slices can implement custom arithmetic units and parallel processing pipelines. The FPGA's high-speed transceivers enable low-latency connections to CPUs and GPUs via PCIe Gen3. With 500 I/Os, it can interface with high-bandwidth memory and network interfaces. The device's power efficiency at 28nm makes it suitable for dense computing clusters where thermal management is critical.
Empfohlen
Wired Communications
The XC7K410T-2FFG900I is designed for wired communications infrastructure, including switches, routers, and base stations. It supports 10 Gigabit Ethernet and PCIe Gen3, making it ideal for high-throughput packet processing. The 500 I/Os allow flexible interfacing with PHYs and network processors, while the high-speed transceivers handle backplane connectivity. The FPGA's DSP slices can implement forward error correction (FEC) and equalization algorithms. Its industrial temperature range ensures reliable operation in central offices and remote sites. The device's reconfigurability enables protocol updates without hardware replacement.
Empfohlen
Test and Measurement
In test and measurement equipment such as oscilloscopes, logic analyzers, and signal generators, the XC7K410T-2FFG900I provides the processing power for real-time data acquisition and analysis. Its high-speed transceivers can capture high-bandwidth signals, while the DSP slices perform filtering and triggering. The 500 I/Os interface with ADCs, DACs, and display controllers. The FPGA's reconfigurability allows instrument firmware updates to add new measurement capabilities. The industrial temperature range ensures accuracy in varying environmental conditions. This makes it a cost-effective solution for high-performance test instruments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC7K410T-2FFG900I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC7K410T-2FFG900C | XC7K410T-1FFG900I | XC7K325T-2FFG900I |
|---|---|---|---|---|
| Package | 900-BBGA, FCBGA (FFG900) | 900-BBGA, FCBGA (FFG900) | 900-BBGA, FCBGA (FFG900) | 900-BBGA, FCBGA (FFG900) |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 406,720 | 406,720 | 406,720 | 326,080 |
| Block RAM (bits) | 29,306,880 | 29,306,880 | 29,306,880 | 16,027,200 |
| DSP Slices | 1,540 | 1,540 | 1,540 | 840 |
| User I/O Count | 500 | 500 | 500 | 500 |
| Speed Grade | -2 | -2 | -1 | -2 |
| Temperature Range | -40°C to +100°C | 0°C to +85°C | -40°C to +100°C | -40°C to +100°C |
Wichtigste Unterscheidungsmerkmale
- Higher logic density than XC7K325T (vs. XC7K325T-2FFG900I)
- More DSP slices for signal processing (vs. XC7K325T-2FFG900I)
- Industrial temperature range vs commercial (vs. XC7K410T-2FFG900C)
Designhinweise
The XC7K410T-2FFG900I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (variable by bank). Use a dedicated power management IC to sequence these rails properly. Refer to the Kintex-7 power supply design guidelines in UG475. Ensure adequate decoupling with 100nF and 10uF capacitors placed close to the FPGA pins to minimize voltage ripple.
The XC7K410T-2FFG900I can dissipate significant power, especially when using high-speed transceivers and DSP slices. Use a heatsink or active cooling if the junction temperature exceeds 100°C. The FFG900 package has a thermal resistance of approximately 8°C/W (theta_JA) with airflow. Calculate power dissipation using the Xilinx Power Estimator (XPE) tool to determine cooling requirements.
For high-speed signals, use controlled impedance traces and proper termination. Follow the layout guidelines in UG475 for transceiver and I/O routing. Keep differential pairs tightly coupled and matched in length. Use ground planes under all high-speed areas to reduce EMI. Place bypass capacitors as close to the FPGA power pins as possible.
Compliance-Informationen
RoHS compliant per AMD product page. Not AEC-Q100 qualified as it is not an automotive part.
