XC7K325T-1FBG676C - Kintex-7 FPGA 326K Logic Cells | AMD
Teilenummer: XC7K325T-1FBG676C ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $157.63 | $157,63 |
| 10 | $145.2 | $1.452,00 |
| 100 | $132.8 | $13.280,00 |
| 500 | $120.4 | $60.200,00 |
| 1.000 | $108 | $108.000,00 |
XC7K325T-1FBG676C Übersicht
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit between ASICs (application-specific) and microprocessors (fixed-function) in the design hierarchy, offering reconfigurability and parallel processing. The Kintex-7 family is optimized for price/performance/watt, balancing logic density, DSP capability, and transceiver performance for mid-range to high-end applications.
Key features include 400 I/O pins, 16,404,480 bits of block RAM, and 326,080 logic cells. The device supports multiple speed grades (-1, -2, -3) and includes hardened blocks for PCIe, Gigabit Ethernet, and DDR3 memory controllers. The 676-ball FCBGA package provides excellent thermal and electrical performance for high-speed designs.
Architecturally, the Kintex-7 uses a 6-input look-up table (LUT) fabric with dedicated carry chains, DSP48E1 slices for multiply-accumulate operations, and configurable block RAM. The device integrates Clock Management Tiles (CMTs) with MMCM and PLL for precise clock generation. The 28nm HPL process enables low static power while maintaining high performance.
Typical applications include software-defined radio, high-performance computing, video processing, and aerospace/defense systems. The device's high DSP ratio and transceiver capabilities make it ideal for signal processing and data acquisition. Its support for PCIe Gen2 and DDR3 simplifies system integration.
When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The core voltage must be maintained within 0.97V to 1.03V, and the FCBGA package requires a proper thermal solution for high utilization designs.
Drop-in-Alternativen für XC7K325T-1FBG676C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XC7K325T-1FBG676C (gleiche Bauform und Footprint) – abweichend in Core Voltage, Operating Temperature, Speed Grade, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XC7K325T-2FBG676C
✅ Drop-In✓ Auf Lager
$780 / Stück
Datenblatt ansehen →XC7K325T-1FBG676I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC7K325T-1FFG676C
✅ Drop-In✓ Auf Lager
$350 / Stück
Datenblatt ansehen →CWC2P300T-FFG676I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC7K325T-1FBG676C Grenzwerte & elektrische Eigenschaften
| Family | Kintex-7 |
| Logic Cells | 326080 |
| Block RAM | 16404480 bits |
| Number of I/Os | 400 |
| Gehäuse | 676-BBGA, FCBGA |
| Core Voltage | 1.0 V (0.97V to 1.03V) |
| Technology | 28nm |
| Speed Grade | -1 |
| Maximum Frequency | 400 MHz |
| Betriebstemperatur | 0C to +85C |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| REACH Status | Compliant |
| Series | Kintex-7 |
| Number of Logic Elements | 326080 |
XC7K325T-1FBG676C Pin-Konfiguration
| Pin A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Pin A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Pin B1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| Pin B2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| Pin C1 | VCCINT — Internal core voltage 1.0V |
| Pin C2 | GND — Ground |
| Pin D1 | VCCAUX — Auxiliary voltage 1.8V |
| Pin D2 | GND — Ground |
| Pin E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| Pin E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| Pin F1 | IO_L4P_T0 — User I/O bank 0, differential pair P |
| Pin F2 | IO_L4N_T0 — User I/O bank 0, differential pair N |
Typische Anwendungen
XC7K325T-1FBG676C ist geeignet für 6 Anwendungs: Software Defined Radio, High-Performance Computing, Video Processing, Aerospace and Defense, Data Acquisition and Instrumentation, Telecommunications Infrastructure.
Software Defined Radio
The XC7K325T-1FBG676C excels in software-defined radio (SDR) systems due to its high DSP ratio and 400 I/Os. With 326,080 logic cells and 16.4 Mb of block RAM, it can implement complex digital down-conversion, filtering, and modulation algorithms. The 28nm process enables low power consumption, critical for portable and field-deployed radios. The device supports multiple high-speed serial transceivers for ADC/DAC interfaces, and its MMCM/PLL blocks provide precise clock generation for RF sampling. This FPGA enables reconfigurable waveforms and multi-standard support, making it ideal for military and commercial SDR platforms.
Empfohlen
High-Performance Computing
In high-performance computing (HPC), the XC7K325T-1FBG676C provides massive parallel processing capabilities with 326,080 logic cells. Its DSP48E1 slices enable efficient multiply-accumulate operations for scientific computing, financial modeling, and data analytics. The 400 I/Os support high-bandwidth memory interfaces like DDR3, and the 28nm technology balances performance with power efficiency. The device can accelerate algorithms by 10-100x compared to CPUs for specific workloads. Its PCIe support enables seamless integration into server systems, making it a cost-effective accelerator for data centers and research institutions.
Empfohlen
Video Processing
The XC7K325T-1FBG676C is well-suited for video processing applications, offering 400 I/Os and 16.4 Mb of block RAM for frame buffering. Its 326,080 logic cells can implement complex video codecs, image scaling, and real-time enhancement algorithms. The device supports multiple video standards through its flexible I/O, and the 28nm process enables low-latency processing. With support for PCIe and DDR3, it can handle 4K video streams at 60fps. The MMCM/PLL blocks generate precise pixel clocks, ensuring synchronization across multiple video channels. This makes it ideal for broadcast, medical imaging, and surveillance systems.
Empfohlen
Aerospace and Defense
The XC7K325T-1FBG676C is designed for aerospace and defense applications, offering high reliability and performance in a 676-FCBGA package. Its 326,080 logic cells support complex radar, sonar, and electronic warfare processing. The device operates over the commercial temperature range (0C to +85C) and can be paired with industrial-grade variants for harsher environments. The 28nm technology provides radiation tolerance suitable for many defense applications. With 400 I/Os, it interfaces with a wide range of sensors and communication systems. The FPGA's reconfigurability allows for in-field updates, critical for evolving mission requirements.
Empfohlen
Data Acquisition and Instrumentation
The XC7K325T-1FBG676C is ideal for data acquisition systems, providing 400 I/Os for interfacing with high-speed ADCs and DACs. Its 326,080 logic cells enable real-time signal processing, triggering, and data reduction. The 16.4 Mb block RAM supports large data buffers, while the 28nm process ensures low power for portable instruments. The device's MMCM/PLL blocks generate precise sampling clocks, critical for accurate measurements. With PCIe support, it can stream data to host computers at high rates. This makes it suitable for oscilloscopes, spectrum analyzers, and scientific instruments.
Empfohlen
Telecommunications Infrastructure
The XC7K325T-1FBG676C is a key component in telecommunications infrastructure, offering high-speed serial transceivers and 400 I/Os for backplane and line card interfaces. Its 326,080 logic cells implement packet processing, error correction, and protocol conversion. The device supports PCIe and Gigabit Ethernet, enabling seamless integration into network equipment. The 28nm technology provides the performance needed for 100G+ systems while managing power consumption. With 16.4 Mb of block RAM, it can buffer large packets and support Quality of Service (QoS) algorithms. This makes it ideal for routers, switches, and base stations.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC7K325T-1FBG676C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC7K325T-2FBG676C | XC7K325T-1FBG676I | XC7K325T-1FFG676C | CWC2P300T-FFG676I |
|---|---|---|---|---|---|
| Package | 676-FCBGA (FBG) | 676-FCBGA (FBG) | 676-FCBGA (FBG) | 676-FCBGA (FFG) | 676-FCBGA (FFG) |
| Brand | AMD | AMD | AMD | AMD | Chengdu Sino Microelectronics |
Wichtigste Unterscheidungsmerkmale
- Higher speed grade option (vs. XC7K325T-1FBG676C vs XC7K325T-2FBG676C)
- Industrial temperature range (vs. XC7K325T-1FBG676C vs XC7K325T-1FBG676I)
- Lidless package for thermal performance (vs. XC7K325T-1FBG676C vs XC7K325T-1FFG676C)
Designhinweise
The XC7K325T-1FBG676C requires a 1.0V core supply (VCCINT) with tight regulation (0.97V to 1.03V). Use a dedicated switching regulator with remote sensing to maintain accuracy under dynamic load. Decouple each VCCINT pin with a 100nF ceramic capacitor and add bulk capacitance (10uF) per power region. The VCCAUX rail (1.8V) should be similarly decoupled. Follow AMD's power distribution network (PDN) guidelines in UG583 for optimal performance.
The 676-FCBGA package has a thermal resistance that requires careful management. For high-utilization designs, use a heatsink with forced airflow. The lidless FBG package allows direct contact with the die for improved thermal performance. Calculate power dissipation using AMD's Power Estimator tool and ensure junction temperature stays below 85C for commercial grade. Consider the thermal vias under the package for heat spreading to the PCB ground plane.
For the 676-FCBGA package, use a high-layer-count PCB (12-16 layers) with controlled impedance for high-speed signals. Route differential pairs with 100-ohm impedance for transceivers. Place decoupling capacitors on the bottom side directly under the BGA pads. Follow AMD's PCB design guidelines in UG583 for stack-up, via placement, and signal integrity. Use the package pinout files from AMD for accurate footprint creation.
Compliance-Informationen
RoHS and REACH compliant per distributor data. Not AEC-Q100 qualified as it is not an automotive-grade part.
