P1022NSN2MHB
P1022NSN2MHB - QorIQ P1 Dual-Core SoC, 1.055GHz | NXP
The NXP P1022NSN2MHB is a dual-core Power Architecture (e500v2) QorIQ P1 system-on-chip (SoC) microprocessor running at 1.055 GHz core frequency, housed in a 689-ball TEPBGA II (31 x 31 mm) package. The device integrates dual 32-bit PowerPC e500v2 cores with 36-bit physical addressing, a high-speed interconnect fabric, and a rich peripheral set that includes GbE, PCIe, USB, DDR2/DDR3 with ECC, LCD controller, security engine, and SATA. According to the manufacturer part description, the P1022 family is designed to deliver complex application processing performance with exceptional feature integration and high-speed connectivity for IP networking and advanced media processing.
A QorIQ SoC belongs to the power-architecture communications processor family - an integrated multiprocessor IC that combines CPU cores, memory controllers, and networking/connectivity peripherals on a single die. Within the broader taxonomy, QorIQ P1 sits beneath the QorIQ P-series (communications), below the QorIQ platform tier, and ultimately under the Power Architecture / embedded microprocessor category. The P1 tier targets cost- and power-sensitive networking and industrial applications where a single-chip SoC replaces a CPU plus external chipset.
Key features of the P1022NSN2MHB include dual 1.055 GHz e500v2 cores with integrated FPU/LSU per core, 32 KB I-cache and 32 KB D-cache per core, a DDR2/DDR3 SDRAM controller with ECC support up to 800 MT/s data rate, three 10/100/1000 Mbps enhanced Gigabit Ethernet controllers (eTSECs), two PCIe interfaces (PCIe x4 + PCIe x1 or x4 + x4 configuration), one USB 2.0 controller with ULPI interface, integrated LCD controller supporting up to 1280 x 1024 resolution, SATA 2.0 interface, SD/MMC host controller, two I2C controllers, four UARTs, enhanced SPI, and a security engine supporting DES/3DES, AES, RSA, and ARC4. Power management is provided through a sophisticated voltage and frequency scaling infrastructure. The operating temperature range spans -40C to +125C, indicating the part targets industrial and extended-temperature applications.
Technically, the P1022 implements a hierarchical interconnect with separate CoreNet platform and peripheral bus, enabling concurrent high-bandwidth data movement between cores, memory, and networking engines. This architecture minimizes contention when simultaneously running packet processing, control-plane tasks, and media workloads. ECC on the DDR controller protects against single-bit memory errors critical for network and storage reliability, while the integrated LCD controller eliminates the need for an external graphics chip in HMI applications.
Typical applications for this SoC include industrial networking gateways, factory-automation controllers, multi-port Ethernet switches/routers, network-attached storage (NAS) controllers, industrial IoT edge nodes, secure point-of-sale terminals, and embedded HMI panels. The device is also used in smart-grid substation equipment and other long-lifecycle industrial platforms where its -40C to +125C range is mandatory.
Designers should budget power carefully: at 1.055 GHz the device draws several watts, and a multilayer PCB with continuous ground planes plus thermal vias under the exposed pad is required. The TEPBGA II package has a large ball count (689), so 4-6 layer PCB with 0.8 mm or finer pitch fanout, microvia-in-pad, and controlled-impedance routing for DDR/PCIe/SerDes traces is mandatory for signal integrity.
This page synthesizes NXP part documentation, distributor pricing, and same-family drop-in alternatives - not all of which are aggregated on a single distributor product page.
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