P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking
Teilenummer: P1022NXN2LFB ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $92.06 | $92,06 |
| 10 | $89.5 | $895,00 |
| 100 | $85.2 | $8.520,00 |
| 500 | $81.75 | $40.875,00 |
| 1.000 | $78.4 | $78.400,00 |
P1022NXN2LFB Übersicht
A QorIQ processor is a system-on-chip (SoC) family within NXP's communications-platform portfolio, positioning it above discrete microcontrollers and below enterprise-class multi-core CPUs in the taxonomy: SoC -> communications processor -> QorIQ platform -> Power Architecture implementation. QorIQ parts are engineered specifically for high-throughput packet processing, secure networking, and intelligent edge gateways. The P1022 family sits in the value-tier of QorIQ, balancing dual-core performance with the integration of network and storage peripherals.
Key features of the P1022NXN2LFB include 1067/533/667 ET NE r1.1 platform versioning, dual e500 cores with hardware MMU and 36-bit physical addressing, DDR2/DDR3 memory controller supporting up to 32-bit ECC, three 10/100/1000 Ethernet MACs, three PCIe Gen1 interfaces, USB 2.0 host/device, four TDM/I2S interfaces, and a 32-bit LCD controller. The integrated security engine supports symmetric and asymmetric crypto acceleration. Hardware virtualization is provided through the embedded hypervisor extensions.
The P1022NXN2LFB is built on a 45 nm low-power process, with voltage rails between 3.13 V and 3.47 V at the core supply domain. The architecture combines a 256 KB shared L2 cache per core with a platform cache fabric, yielding determinism for control-plane workloads. Compared to the smaller P1013 (single-core), the P1022 adds a second e500 core for symmetric multiprocessing workloads, and compared to the P1020 the P1022 offers higher DDR frequency support.
Typical applications include industrial routers and gateways, factory-floor protocol converters, smart-grid concentrators, multi-service access equipment, line cards for branch routers, military/aerospace networking, networked printers, and edge-of-network media gateways. Its extended temperature range and RoHS/halogen-free TEPBGA package make it suited to long-life industrial designs. When designing with this part, ensure the PCB supports the large 31 x 31 mm BGA land pattern, plan thermal vias under the exposed die area, and validate DDR3/DDR2 IBIS-AMI models for SI compliance on multi-rank memory subsystems.
Drop-in-Alternativen für P1022NXN2LFB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P1022NXN2LFB (gleiche Bauform und Footprint) – abweichend in Operating Temperature, USB, Memory Controller, PCI Express, Security Engine.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
P1022NXN2HFB
✅ Drop-In✓ Auf Lager
$52.65 / Stück
Datenblatt ansehen →P1022NSE2HFB
✅ Drop-In✓ Auf Lager
$75 / Stück
Datenblatt ansehen →P1021NXE2HFB
✅ Drop-In✓ Auf Lager
$112.8 / Stück
Datenblatt ansehen →P1020NSE2HFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1013NSE2LFB
✅ Drop-In✓ Auf Lager
$79.55 / Stück
Datenblatt ansehen →P1022NXN2LFB Grenzwerte & elektrische Eigenschaften
| Architecture | Power Architecture e500 dual-core (RISC, 32-bit) |
| Clock Speed (Core) | 1.067 GHz |
| Platform Version | 1067/533/667 ET NE r1.1 |
| Core Count | 2 |
| Package Type | TEPBGA-689 (Plastic, halogen-free, RoHS-compliant) |
| Package Dimensions | 31 x 31 mm, 2.23 mm height |
| Pin-Anzahl | 689 |
| Betriebstemperatur | -40 °C to +125 °C (industrial) |
| Versorgungsspannung | 3.13 V to 3.47 V |
| Memory Controller | DDR2/DDR3 with ECC support, up to 32-bit |
| Ethernet MACs | 3 x 10/100/1000 Mbps Gigabit |
| PCIe Interfaces | 3 x PCIe Gen1 |
| USB | USB 2.0 host/device |
| Display Controller | 32-bit LCD controller |
| Security Engine | Integrated (symmetric/asymmetric crypto acceleration) |
| RoHS Compliance | Yes (halogen-free) |
| Montageart | Surface Mount (BGA, requires thermal via array under die) |
P1022NXN2LFB 31 x 31 mm, 2.23 mm height Pinbelegungsleitfaden
Pinbelegung für P1022NXN2LFB (31 x 31 mm, 2.23 mm height-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P1022NXN2LFB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P1022NXN2LFB ist geeignet für 7 Anwendungs: Industrial Router / Branch Gateway, Smart-Grid Concentrator / Substation Gateway, Factory Floor Protocol Converter, Multi-Service Access Equipment / Line Card, Networked Printer / Multi-Function Peripheral Controller, Edge-of-Network Media Gateway, Avionics / Military Networking Subsystem.
Industrial Router / Branch Gateway
The P1022NXN2LFB is well-matched to industrial routers because its dual 1.067 GHz e500 cores can split the control plane (routing protocols, IPSec) from the data plane (packet forwarding, QoS). The three integrated Gigabit Ethernet MACs supply enough interfaces for WAN, LAN, and DMZ ports without an external switch, while the DDR3-with-ECC controller protects routing tables against soft errors in industrial environments. The 689-ball TEPBGA and 3.13 V – 3.47 V supply simplify power-tree design, and the -40 °C to +125 °C temperature range supports outdoor cabinet deployments.
Empfohlen
Smart-Grid Concentrator / Substation Gateway
Substation automation gateways benefit from the P1022NXN2LFB's industrial temperature rating, deterministic dual-core performance, and integrated security engine for IEC 62351 compliance. The third PCIe lane can host a hardware crypto accelerator or cellular modem, while DDR3-with-ECC keeps buffered fault records intact through single-bit upsets common in high-voltage switchgear environments. The package's halogen-free, RoHS construction meets substation equipment environmental specifications, and the three GbE MACs allow daisy-chained IEC 61850 networks.
Empfohlen
Factory Floor Protocol Converter
The P1022NXN2LFB's mix of Ethernet MACs, USB 2.0, PCIe, and TDM/I2S interfaces matches the requirements of protocol-conversion gateways that bridge Profinet, EtherCAT, Modbus TCP, and legacy serial fieldbus. Dual-core processing lets one core run the deterministic real-time protocol stack while the other executes management-plane HTTP/SNMP agents without jitter-induced latency. The 32-bit LCD controller drives diagnostic panels common on shop-floor HMIs, and the extended -40 °C to +125 °C temperature window supports installation in control cabinets next to variable-frequency drives.
Empfohlen
Multi-Service Access Equipment / Line Card
Service-provider line cards that combine voice (TDM/I2S), data (Gigabit Ethernet), and video (PCIe-attached DSP or FPGA) benefit from the P1022NXN2LFB's peripheral integration, which eliminates several external bridges. The DDR3 controller feeds the line-rate packet buffer while the hardware crypto engine accelerates IPsec and MACsec. Hardware virtualization extensions permit carrier-grade partition between control and forwarding, and the 689-ball TEPBGA with proper thermal via arrays fits the typical ATCA/AMC line-card envelope.
Empfohlen
Networked Printer / Multi-Function Peripheral Controller
Office MFPs and production printers use the P1022NXN2LFB to run page-description-language interpreters (PostScript, PCL) on one e500 core while the second core drives the LCD UI, scan pipeline, and Gigabit Ethernet network stack. The 32-bit LCD controller directly drives the operator panel, USB 2.0 supports host-side printing and mass-storage services, and the PCIe Gen1 lanes attach to optional scanner or fax modems. The 689-ball TEPBGA provides the thermal mass needed for unattended, fanless operation.
Empfohlen
Edge-of-Network Media Gateway
Edge media gateways that bridge TDM, VoIP, and IP video benefit from the P1022NXN2LFB's TDM/I2S interfaces, hardware security engine, and dual GbE MACs. One core can run an RTOS for media-codec processing while the other handles signalling stacks such as SIP. The extended temperature window enables outdoor enclosure mounting, and the integrated security engine accelerates SRTP and DTLS without offloading to a co-processor. PCIe gives headroom to add hardware video transcoding when the application grows.
Empfohlen
Avionics / Military Networking Subsystem
Avionics and military-grade networking equipment can use the P1022NXN2LFB as a rugged industrial networking compute node, leveraging the -40 °C to +125 °C range, the deterministic dual-core architecture, and the ECC-protected DDR3 subsystem. The hardware crypto engine accelerates Type-1-style encryption algorithms, and the three GbE MACs align with standard ARINC 664 / FACE architectures. When designing for avionics, follow DO-254/DO-178C processes to qualify firmware and confirm thermal margins via the TEPBGA's full-cavity thermal-via array.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P1022NXN2LFB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P1022NXN2HFB | P1022NSE2HFB | P1021NXE2HFB | P1020NSE2HFB | P1013NSE2LFB |
|---|---|---|---|---|---|---|
| Package | TEPBGA-689 (31 x 31 mm) | TEPBGA-689 (31 x 31 mm) - same | TEPBGA-689 (31 x 31 mm) - same | TEPBGA-689 (31 x 31 mm) - same | TEPBGA-689 (31 x 31 mm) - same | TEPBGA-689 (31 x 31 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Architecture | Dual e500 (Power Architecture 32-bit) | Dual e500 (Power Architecture 32-bit) | Dual e500 (Power Architecture 32-bit) | Single e500 (Power Architecture 32-bit) | Dual e500 (Power Architecture 32-bit) | Single e500 (Power Architecture 32-bit) |
| Core Count | 2 | 2 | 2 | 1 | 2 | 1 |
| Memory Controller | DDR2/DDR3 with ECC (32-bit) | DDR2/DDR3 with ECC (32-bit) | DDR2/DDR3 with ECC (32-bit) | DDR2/DDR3 with ECC (32-bit) | DDR2/DDR3 with ECC (32-bit) | DDR2/DDR3 with ECC (32-bit) |
| Ethernet MACs | 3 x 10/100/1000 | 3 x 10/100/1000 | 3 x 10/100/1000 | 3 x 10/100/1000 | 3 x 10/100/1000 | 3 x 10/100/1000 |
| PCIe Interfaces | 3 x PCIe Gen1 | 3 x PCIe Gen1 | 3 x PCIe Gen1 | 3 x PCIe Gen1 | 3 x PCIe Gen1 | 3 x PCIe Gen1 |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +105 °C | -40 °C to +125 °C | -40 °C to +105 °C |
| Lifecycle Status (2026-10-09) | EOL / Last-Time-Buy | EOL / Last-Time-Buy | EOL / Last-Time-Buy | EOL / Last-Time-Buy | EOL / Last-Time-Buy | EOL / Last-Time-Buy |
Wichtigste Unterscheidungsmerkmale
- Only dual-core QorIQ P10xx at 1.067 GHz with the NXL/L extension code (vs. P1022NXN2HFB)
- Dual-core headroom for split control/data planes (vs. P1021NXE2HFB)
- Higher DDR3 frequency ceiling than P1020 (vs. P1020NSE2HFB)
Designhinweise
The 689-ball TEPBGA package exposes the die through the bottom thermal pad. Estimated: at the worst-case core clock of 1.067 GHz and 3.3 V VDD, designers should simulate junction temperature for fanless and fan-cooled enclosures using the NXP-published theta-JB and theta-JC values. Populate a full-cavity thermal via array on all inner PCB layers directly beneath the package thermal pad and stitch the top copper pour with multiple vias to spread heat laterally.
Use a high-density interconnect (HDI) stack-up with micro-vias for fanout from the 31 x 31 mm BGA. Match DDR3 trace lengths within ±25 mil and add SI-grade termination to maintain signal integrity at 533–800 MHz data rates. Keep analog and digital ground returns separate until they meet at a single point under the SoC's GND ball grid to minimize switching-current noise.
Do not assume any QorIQ P-series variants share pinout just because they have the same package code - confirm the specific device's ball-map revision with the NXP reference manual. The 'ET NE' or 'ES' speed codes change the maximum core clock, DDR3 frequency, and thermal envelopes, so a wrong speed grade can cause marginal timing failures only seen at temperature corners.
The P1022NXN2LFB draws substantially different current between the core (Vdd_core), platform (Vdd_platform), and DDR I/O (GVDD) rails. Estimated at idle the platform current may be 1-2 A; full-load 1.067 GHz operation requires substantial decoupling. Place 10 µF X7R bulk plus 0.1 µF + 0.01 µF high-frequency ceramics on every regulator output, and use a controller such as LTC3633AIUFD for the core rail.
Compliance-Informationen
Per the digchip summary, the P1022NXN2LFB is halogen-free, RoHS-compliant, plastic TEBGA-689. AEC-Q100 is not applicable for industrial-grade networking SoCs; consult NXP for any automotive compliance data.
