SPC5748GGK1VM
SPC5748GGK1VM - 120MHz Tri-Core 6MB MCU | NXP
The NXP Semiconductors SPC5748GGK1VM is a 32-bit Tri-Core Qorivva automotive microcontroller operating at 80MHz or 120MHz, with 6MB of flash memory and a 256-pin MAPPBGA package measuring 17 x 17 mm. It belongs to the MPC57xx family and combines multiple processor cores with embedded Flash for demanding vehicle control, chassis, powertrain, gateway, and industrial applications.
A microcontroller is a programmable semiconductor that integrates a CPU, memory, and peripherals into one device. In the broader hierarchy, SPC5748GGK1VM is a 32-bit microcontroller, a RISC processor-based embedded controller, and a semiconductor designed to execute firmware and manage electronic systems. Its Tri-Core architecture provides dedicated execution resources within one package for concurrent control and communication tasks.
Verified distributor data identifies an e200z2/e200z4-based MPC57xx Qorivva device with 80MHz and 120MHz operating options. The controller provides 6MB, or 6M x 8 bits, of embedded Flash. Its 256-MAPPBGA package supports compact, high-density automotive PCB layouts, but exact power-supply limits, memory-map details, peripheral configuration, and temperature ratings were not included in the supplied records and must be confirmed in MPC5748G.pdf.
The principal design benefit is integration: multiple processing capability and 6MB of on-chip Flash reduce the need for external program memory in control-intensive systems. The Tri-Core platform can divide interrupt-heavy, communications, and supervisory workloads across its cores, subject to the memory and peripheral resources defined by the complete device configuration. The package’s 256-ball pitch and thermal requirements demand careful PCB escape routing and power-plane design.
Typical automotive uses include electronic control units, powertrain and chassis controllers, vehicle body modules, gateway systems, and motor-control platforms. Its 120MHz-class processing is also relevant to industrial automation where deterministic embedded control, robust Flash integration, and high-pin-count connectivity are valuable. Distributor listings also associate the device with compact IoT, wearable, and smart-home designs, although those markets should be qualified against the exact automotive-product requirements before use.
Engineers should preserve the 256-MAPPBGA footprint, ball assignment, power sequencing, decoupling, and exposed-pad thermal constraints during design-in. A software-compatible replacement must match more than processor speed: it must match Flash, memory organization, peripheral mapping, clocking, safety documentation, package, and production qualification. This page consolidates verified sourcing data, package information, selection guidance, and design cautions while marking unspecified technical parameters for further datasheet review.
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