10AS032H2F34E2SG vs 10AS032H2F34E2LG Vergleich
Detaillierter Direktvergleich von 10AS032H2F34E2SG von Altera und 10AS032H2F34E2LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AS032H2F34E2SG | 10AS032H2F34E2LG |
|---|---|---|
| Marke | Altera | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.410,00 | $1.380,00 |
| Family | Arria 10 SX | Arria 10 SX |
| Device | 10AS032 | — |
| Logic Elements | 320,000 | 320,000 |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Frequency | 1.5 GHz (max) | — |
| Process Technology | 20 nm | — |
| Gehäuse | 1152-pin FC-FBGA (F34), 35 x 35 mm | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| Montageart | Surface Mount, BGA | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Core Voltage | 0.9 V (typical) | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature grade] | — |
| Logic Array Blocks | [DATA_NEEDED: LAB count] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | Variable-precision, IEEE 754 single-precision FP support |
| Transceivers | [DATA_NEEDED: transceiver count and rate] | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] |
| Memory | Integrated DDR4 hard memory controller | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Terminal Count | 1152 | — |
| Device Tier | — | 10AS032 (mid-density) |
| Configuration | — | SoC FPGA (HPS + FPGA fabric) |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Operating Frequency | — | 1.5 GHz |
| Speed Grade | — | 2 |
| Temperature Grade | — | E2 (commercial/extended) |
| On-chip Memory (M20K blocks) | — | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] |
| Memory Controller Hard IP | — | DDR4, DDR3, QDRII+, RLDRAM3 |
| Process Node | — | 20 nm |
| Form of Terminal | — | Ball (BGA) |
| Terminal Pitch | — | 1 mm |