10AS032H2F34E2SG - Arria 10 SX 320K LE SoC FPGA | Altera / Intel
Teilenummer: 10AS032H2F34E2SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1760.42 | $1.760,42 |
| 10 | $1675 | $16.750,00 |
| 100 | $1585 | $158.500,00 |
| 500 | $1495 | $747.500,00 |
| 1.000 | $1410 | $1.410.000,00 |
10AS032H2F34E2SG Übersicht
A System-on-Chip (SoC) FPGA is an integrated circuit that combines a programmable logic (FPGA) fabric with one or more hard processor cores on a single die, enabling hardware/software co-design. Within the broader taxonomy, an SoC FPGA sits at the intersection of FPGA (programmable gate array), ASIC (application-specific integrated circuit), and microprocessor/microcontroller, allowing designers to allocate compute-intensive functions (DSP, packet processing, encryption) to dedicated FPGA fabric while running control software, OS, and networking stacks on the embedded processor cores. The Arria 10 SX family specifically delivers mid-range FPGA logic density with high-end DSP and transceiver bandwidth.
Key features of the 10AS032H2F34E2SG include 320K logic elements, hard DDR4 memory controller support, integrated transceivers, and a high-bandwidth processor-to-FPGA bridge. The 20nm process technology delivers improved performance per watt compared with the previous 28nm Arria V generation. The 1.5 GHz dual-core ARM Cortex-A9 subsystem provides NEON media processing engines and includes CoreSight debug infrastructure for trace and performance monitoring.
Typical applications include wireless baseband processing, radar and signal intelligence systems, broadcast video infrastructure, industrial machine vision, and high-performance test & measurement equipment. The integrated HPS makes the device well suited to designs that must boot an embedded Linux or RTOS while simultaneously accelerating DSP pipelines in fabric.
Design considerations include careful PCB layout for the 1152-ball FC-FBGA, dedicated power rail sequencing for the FPGA core, HPS, and transceivers, and thermal management at the 35 x 35 mm package scale. Designers should follow Altera's pin connection guidelines to ensure unused FPGA pins are properly terminated and the HPS boot configuration pins are correctly set.
This page synthesizes distributor stock and pricing, package details, and drop-in alternatives sourced from real-time web searches that engineers can compare alongside the manufacturer datasheet.
Drop-in-Alternativen für 10AS032H2F34E2SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS032H2F34E2SG (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Mounting Type, Configuration, DSP Blocks.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS032H2F34E2LG
✅ Drop-In✓ Auf Lager
$1380 / Stück
Datenblatt ansehen →10AS032H2F34E1HG
✅ Drop-In✓ Auf Lager
$1227.9 / Stück
Datenblatt ansehen →10AS032H1F35I1HG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2265 / Stück
Datenblatt ansehen →10AS032H1F34I1HG
✅ Drop-In✓ Auf Lager
$2077.26 / Stück
Datenblatt ansehen →10AS032H1F34E1HG
✅ Drop-In✓ Auf Lager
$1755 / Stück
Datenblatt ansehen →10AS032E4F29I3SG
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2250 / Stück
Datenblatt ansehen →10AS027H3F34E2SG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10AS032H2F34E2SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX |
| Device | 10AS032 |
| Logic Elements | 320,000 |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Frequency | 1.5 GHz (max) |
| Process Technology | 20 nm |
| Gehäuse | 1152-pin FC-FBGA (F34), 35 x 35 mm |
| Montageart | Surface Mount, BGA |
| RoHS-Status | Compliant |
| Core Voltage | 0.9 V (typical) |
| Memory | Integrated DDR4 hard memory controller |
| Package Code | BGA |
| Package Shape | Square |
| Terminal Form | Ball |
| Terminal Count | 1152 |
10AS032H2F34E2SG square Pinbelegungsleitfaden
Pinbelegung für 10AS032H2F34E2SG (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS032H2F34E2SG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS032H2F34E2SG ist geeignet für 6 Anwendungs: Wireless Baseband Processing, Radar and Signal Intelligence, Broadcast Video Infrastructure, Industrial Machine Vision, Test and Measurement Equipment, Medical Imaging and Diagnostics.
Wireless Baseband Processing
The 10AS032H2F34E2SG's 320K logic elements and dual ARM Cortex-A9 HPS running up to 1.5 GHz make it a strong fit for wireless baseband processing. The FPGA fabric accelerates PHY-layer DSP functions such as FFT, channel estimation, and FEC decoding, while the Cortex-A9 cores handle MAC-layer scheduling, protocol stack, and management plane tasks. Compared with ASIC + external CPU designs, an SoC FPGA reduces board area and BOM by integrating the processor and accelerator on a single die. The 20nm Arria 10 SX architecture provides the DSP block density and transceiver bandwidth needed for LTE and 5G NR baseband implementations.
Empfohlen
Radar and Signal Intelligence
For radar and SIGINT systems, the 10AS032H2F34E2SG integrates high-speed DSP, large logic capacity, and a hard processor on one chip. The FPGA fabric performs wideband digital downconversion, pulse compression, and beamforming in real time, while the Cortex-A9 subsystem handles target tracking, classification, and operator interfaces. The 1.5 GHz HPS with NEON engines accelerates vector math for STAP and adaptive filtering. Compared with separate DSP + MCU solutions, the SoC FPGA reduces latency between the FPGA fabric and the processor, critical for time-sensitive signal processing tasks.
Empfohlen
Broadcast Video Infrastructure
Broadcast video head-ends and contribution encoders benefit from the 10AS032H2F34E2SG's combination of high logic density and an embedded processor. The FPGA fabric implements multi-stream HEVC/H.264 encoding, transrating, and color space conversion at 4K/UHD resolutions, while the Cortex-A9 subsystem runs control software, IP stack, and web management interfaces. The integrated DDR4 controller supports the high memory bandwidth required for uncompressed video buffers. Compared with a CPU-only encoder, the SoC FPGA provides the parallel processing horsepower needed to encode multiple HD streams simultaneously.
Empfohlen
Industrial Machine Vision
Factory automation and machine vision systems use the 10AS032H2F34E2SG to combine high-speed image processing with embedded control. The FPGA fabric handles multi-camera sensor aggregation, Bayer demosaicing, edge detection, and convolutional neural network inference, while the ARM Cortex-A9 subsystem runs the vision application, communicates with PLCs over Ethernet/IP or PROFINET, and drives HMI displays. The 20nm Arria 10 SX silicon provides the logic density and DSP blocks needed for real-time inspection. Compared with GPU + x86 solutions, the SoC FPGA delivers deterministic latency critical to factory-line timing.
Empfohlen
Test and Measurement Equipment
High-end oscilloscopes, protocol analyzers, and RF test instruments use the 10AS032H2F34E2SG as a central processing hub. The FPGA fabric digitizes and pre-processes signals at multi-GS/s rates with low latency, while the Cortex-A9 subsystem handles instrument calibration, display rendering, and remote-control interfaces such as LXI or USB. The 1.5 GHz HPS plus NEON engines accelerate FFT-based spectrum analysis. Compared with dedicated ASIC front ends plus an external processor, the SoC FPGA offers flexible reconfigurability for evolving test standards.
Empfohlen
Medical Imaging and Diagnostics
Medical imaging systems such as ultrasound carts and MRI reconstruction platforms leverage the 10AS032H2F34E2SG's combination of DSP bandwidth and an embedded processor. The FPGA fabric performs beamforming, FIR filtering, and image reconstruction algorithms in real time, while the ARM Cortex-A9 cores handle patient data interfaces, DICOM stack, and touch-screen UI. The integrated DDR4 hard controller delivers the memory throughput needed for high-resolution image buffers. Compared with CPU + GPU architectures, the SoC FPGA provides deterministic processing latency essential to diagnostic accuracy.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS032H2F34E2SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS032H2F34E2LG | 10AS032H2F34E1HG | 10AS032H1F34I1HG | 10AS027H3F34E2SG |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-FBGA, FC (F34), 35x35 mm | 1152-FBGA, FC (F34) - same | 1152-FBGA, FC (F34) - same | 1152-FBGA, FC (F34) - same | 1152-FBGA, FC (F34) - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 270,000 |
| Processor Core | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz | Dual ARM Cortex-A9 1.5 GHz |
| Speed Grade | H2 (E2) | H2 (E2) | H2 (E1) | H1 (I1) | H3 (E2) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Highest-density Arria 10 SX in F34 package (vs. 10AS027H3F34E2SG)
- H2 speed grade gives highest performance in F34 footprint (vs. 10AS032H2F34E1HG)
- Integrated dual-core ARM Cortex-A9 SoC (vs. 10AS032E4F29I3SG)
Designhinweise
The 1152-pin FC-FBGA F34 package requires high-density PCB design with microvia stack-ups, controlled-impedance routing for transceivers, and matched-length lanes for DDR4. Allocate at least 8 PCB layers and follow Altera's recommended BGA breakout pattern with 1.0mm pitch. Use a continuous ground plane beneath the BGA to provide a return path and thermal dissipation, and consider via-in-pad with filled/capped vias for high-current rails. Failure to follow BGA layout guidelines can result in solder defects and signal-integrity issues at multi-GHz transceiver rates.
The 35 x 35 mm FC-FBGA package must dissipate significant heat, especially when both FPGA fabric and HPS run at full utilization. Use a thermal interface material (TIM) and attach a heatsink or cold plate directly to the package top, with thermal vias under the central die region. Estimated: at full FPGA fabric utilization the die can dissipate 15-25W, requiring a heatsink rated at <0.5 C/W for industrial temperature operation. Always validate thermal design with a computational fluid dynamics (CFD) simulation or thermal probe measurements.
Common pitfalls with Arria 10 SX designs include: (1) misconfiguring MSEL pins, which select the FPGA configuration scheme and must match the actual boot source (QSPI, SD card, JTAG, etc.); (2) failing to provide proper power-up sequencing for the HPS and FPGA rails per Altera's PowerTree design; (3) leaving JTAG pins floating in production - they should be pulled to a defined state; (4) not following HPS DDR pin-out rules when routing to external memory, which can cause read/write errors. Always review Altera's AN 692 (Arria 10 HPS-to-FPGA bridge) and pin connection guidelines before board bring-up.
Compliance-Informationen
RoHS compliance confirmed by distributor listings on DigiKey and Ampheo. REACH, halogen-free, and conflict-minerals declarations should be confirmed with Intel/Altera directly.
