10AS032H3F35I2SG vs 10AS032H4F35E3LG Vergleich

Detaillierter Direktvergleich von 10AS032H3F35I2SG von Intel und 10AS032H4F35E3LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10AS032H3F35I2SG 10AS032H4F35E3LG
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $2.120,00 $1.195,00
Product Type SoC FPGA (System-on-Chip with ARM Cortex-A9 HPS) —
Family Arria 10 SX —
Logic Elements 320K 320,000
HPS Core Dual ARM Cortex-A9 MPCore with CoreSight —
Maximum HPS Frequency 1.5 GHz —
Gehäuse 1152-ball FCBGA, 35x35 mm —
Montageart Surface Mount (flip-chip BGA) Surface Mount (BGA)
Operating Temperature Grade Industrial (-40C to +100C) —
Process Node 20 nm TSMC —
Transceivers Up to 17.4 Gbps multi-gigabit transceivers —
Memory Interfaces DDR4/DDR3 hard memory controllers —
DSP Blocks Variable-precision DSP blocks Variable-precision DSP blocks
Embedded Memory M20K blocks MLAB + M20K blocks
MSL-Level [DATA_NEEDED: MSL rating] —
RoHS-Status Compliant (per distributor listing) Compliant
Lead-Free Yes (per distributor listing) —
Minimum Supply Voltage 0.87 V (core) —
Series — Arria 10 SX SoC FPGA
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Processor Clock Speed (Max) — 1.5 GHz
Operating Voltage (Core) — 0.87 V (typical per datasheet minimum)
Package Type — 1152-ball FCBGA (Flip-Chip BGA)
Package Size — 35 x 35 mm
Process Technology — 20 nm TSMC
Transceiver Speed — Up to 28.05 Gbps
Memory Interface — DDR3 / DDR4 with ECC support
Betriebstemperatur — [DATA_NEEDED: extended/industrial grade range]

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