10AX090N3F40E2LG vs 10AX090R3F40E2LG Vergleich
Detaillierter Direktvergleich von 10AX090N3F40E2LG von Intel und 10AX090R3F40E2LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX090N3F40E2LG | 10AX090R3F40E2LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.280,00 | $5.750,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 59,234,304 bits | 59,234,304 bits |
| DSP Blocks | 1,518 | Hardened fixed/floating-point DSP blocks (on-die) |
| User I/O Pins | 600 | — |
| Transceivers | Up to 24 full-duplex channels | Multi-gigabit serial transceivers (on-die) |
| Transceiver Data Rate | Up to 14.4 Gbps | — |
| Hard Memory Controllers | Yes (DDR4, DDR3, QDR IV, RLDRAM 3) | — |
| Maximum DDR4 Rate | 2666 Mbps | — |
| PCIe Hard IP | PCIe Gen3 x8 (root port or endpoint) | — |
| Gehäuse | 1517-ball FCBGA, 40 mm | 1517-Ball FCBGA |
| Process Technology | TSMC 20nm | 20 nm |
| Betriebstemperatur | -40C to +100C (extended industrial) | — |
| Core Voltage | 0.9 V typical | — |
| Configuration Encryption | AES-256 bitstream encryption | — |
| Partial Reconfiguration | Supported | — |
| RoHS-Status | Compliant | Compliant |
| User I/O Count | — | 342 |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Montageart | — | Surface Mount |
| Number of Terminals | — | 1517 |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |