10AX090N3F40E2LG vs 10AX090R3F40E2LG Comparación
Comparación detallada lado a lado de 10AX090N3F40E2LG por Intel y 10AX090R3F40E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090N3F40E2LG | 10AX090R3F40E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.280,00 | $5.750,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 59,234,304 bits | 59,234,304 bits |
| DSP Blocks | 1,518 | Hardened fixed/floating-point DSP blocks (on-die) |
| User I/O Pins | 600 | — |
| Transceivers | Up to 24 full-duplex channels | Multi-gigabit serial transceivers (on-die) |
| Transceiver Data Rate | Up to 14.4 Gbps | — |
| Hard Memory Controllers | Yes (DDR4, DDR3, QDR IV, RLDRAM 3) | — |
| Maximum DDR4 Rate | 2666 Mbps | — |
| PCIe Hard IP | PCIe Gen3 x8 (root port or endpoint) | — |
| Encapsulado | 1517-ball FCBGA, 40 mm | 1517-Ball FCBGA |
| Process Technology | TSMC 20nm | 20 nm |
| Temperatura de funcionamiento | -40C to +100C (extended industrial) | — |
| Core Voltage | 0.9 V typical | — |
| Configuration Encryption | AES-256 bitstream encryption | — |
| Partial Reconfiguration | Supported | — |
| Estado RoHS | Compliant | Compliant |
| User I/O Count | — | 342 |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Tipo de montaje | — | Surface Mount |
| Number of Terminals | — | 1517 |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |