10AX090N3F40E2LG vs 10AX090R3F40E2LG 비교
다음의 상세 나란히 비교: 10AX090N3F40E2LG 제조: Intel 및 10AX090R3F40E2LG 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 10AX090N3F40E2LG | 10AX090R3F40E2LG |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $2,280.00 | $5,750.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 59,234,304 bits | 59,234,304 bits |
| DSP Blocks | 1,518 | Hardened fixed/floating-point DSP blocks (on-die) |
| User I/O Pins | 600 | — |
| Transceivers | Up to 24 full-duplex channels | Multi-gigabit serial transceivers (on-die) |
| Transceiver Data Rate | Up to 14.4 Gbps | — |
| Hard Memory Controllers | Yes (DDR4, DDR3, QDR IV, RLDRAM 3) | — |
| Maximum DDR4 Rate | 2666 Mbps | — |
| PCIe Hard IP | PCIe Gen3 x8 (root port or endpoint) | — |
| 패키지 | 1517-ball FCBGA, 40 mm | 1517-Ball FCBGA |
| Process Technology | TSMC 20nm | 20 nm |
| 동작 온도 | -40C to +100C (extended industrial) | — |
| Core Voltage | 0.9 V typical | — |
| Configuration Encryption | AES-256 bitstream encryption | — |
| Partial Reconfiguration | Supported | — |
| RoHS 상태 | Compliant | Compliant |
| User I/O Count | — | 342 |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| 실장 유형 | — | Surface Mount |
| Number of Terminals | — | 1517 |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |