10AX090R2F40E2SG vs 10AX090R3F40E2LG Vergleich
Detaillierter Direktvergleich von 10AX090R2F40E2SG von Intel und 10AX090R3F40E2LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX090R2F40E2SG | 10AX090R3F40E2LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4.750,00 | $5.750,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900000 | 900,000 |
| LABs/CLBs | 339620 | — |
| Total RAM Bits | 59234304 | — |
| User I/O Count | 342 | 342 |
| Package Type | 1517-BBGA, FCBGA | Flip-Chip Ball Grid Array |
| Package Code | F40 (approx. 40mm FCBGA) | — |
| Speed Grade | 2 (R2 -2 transceiver rating) | — |
| Temperature Grade | E2 (Extended: -40C to +100C junction) | — |
| Lead-Free / RoHS | Yes (SG suffix) | — |
| Transceivers | Up to 14.1 Gbps (Arria 10 GX feature) | Multi-gigabit serial transceivers (on-die) |
| DSP Blocks | Variable-precision, hardened floating-point capable | Hardened fixed/floating-point DSP blocks (on-die) |
| Process Node | TSMC 20nm | — |
| Montageart | Surface Mount (FCBGA ball grid) | Surface Mount |
| MSL-Level | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Embedded Memory | — | 59,234,304 bits |
| Process Technology | — | 20 nm |
| Core Supply Voltage | — | 0.9 V |
| Gehäuse | — | 1517-Ball FCBGA |
| Number of Terminals | — | 1517 |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |
| RoHS-Status | — | Compliant |